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نمایش تعداد 1-7 از 7

Managing signal, power and thermal integrity for 3D integration

نوع: Conference Paper

نویسنده : Swaminathan, Madhavan

ناشر: IEEE

سال: 2014

System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction

نوع: Journal Paper

نویسنده : Jianyong Xie; Swaminathan, Madhavan

ناشر: IEEE

سال: 2014

Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

نوع: Journal Paper

نویسنده : Jianyong Xie; Swaminathan, Madhavan

ناشر: IEEE

سال: 2014

FDFD Modeling of Signal Paths With TSVs in Silicon Interposer

نوع: Journal Paper

نویسنده : Biancun Xie; Swaminathan, Madhavan

ناشر: IEEE

سال: 2014

Modeling of Power/Ground Planes Using Triangular Elements

نوع: Journal Paper

نویسنده : Jae Young Choi; Swaminathan, Madhavan

ناشر: IEEE

سال: 2014

Efficient computation of capacitive coupling between planar and cylindrical interconnections

نوع: Conference Paper

نویسنده : Han, Ki Jin; Swaminathan, Madhavan

ناشر: IEEE

سال: 2014

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

نوع: Conference Paper

نویسنده : Raj, P.Markondeya; Chakraborti, Parthasarathi; Sharma, Himani; Han, KyuHwan; Gandhi, Saumya; Sitaraman, Srikrishna; Swaminathan, Madhavan; Tummala, Rao

ناشر: IEEE

سال: 2014

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Managing signal, power and thermal integrity for 3D integration

System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction

Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

FDFD Modeling of Signal Paths With TSVs in Silicon Interposer

Modeling of Power/Ground Planes Using Triangular Elements

Efficient computation of capacitive coupling between planar and cylindrical interconnections

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

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Managing signal, power and thermal integrity for 3D integration

System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction

Electrical&#x2013;Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

FDFD Modeling of Signal Paths With TSVs in Silicon Interposer

Modeling of Power/Ground Planes Using Triangular Elements

Efficient computation of capacitive coupling between planar and cylindrical interconnections

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems