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Practical problems in VLSI physical design automation

نوع: Ebook

نویسنده : Sung Kyu Lim

ناشر: Springer

سال: 2008

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

نوع: Ebook

نویسنده : Sung Kyu Lim (auth.)

ناشر: Springer New York

سال: 2013

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Scan chain and power delivery network synthesis for pre-bond test of 3D ICs

نوع: Conference Paper

نویسنده : Shreepad Panth; Sung Kyu Lim

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Reliability and performance-aware 3D SRAM design

نوع: Journal Paper

نویسنده : Mohit Pathak; Sung Kyu Lim

سال: 2011

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Potential Freeway Congestion Severity Measure: Impact of Continuous Congestion Patterns

نوع: Journal Paper

نویسنده : Jungwook Jun; In-Kyu Lim

سال: 2009

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Transient drain current and propagation delay in SOI CMOS

نوع: Journal Paper

نویسنده : Hyung Kyu Lim; Fossum, J.G.

سال: 1984

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On GPU bus power reduction with 3D IC technologies

نوع: Conference Paper

نویسنده : Young-Joon Lee , Sung Kyu Lim

ناشر: IEEE

سال: 2014

Dynamic Configuration of SSD File Management

نوع: Conference Paper

نویسنده : Hyuk-Kyu Lim , Je-Ho Park

ناشر: IEEE

سال: 2014

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

نوع: Journal Paper

نویسنده : Athikulwongse, Krit; Ekpanyapong, M.; Sung Kyu Lim

ناشر: IEEE

سال: 2014

Fast and accurate full-chip extraction and optimization of TSV-to-wire coupling

نوع: Conference Paper

نویسنده : Peng, Yarui , Petranovic, Dusan , Sung Kyu Lim

ناشر: IEEE

سال: 2014

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Practical problems in VLSI physical design automation

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Scan chain and power delivery network synthesis for pre-bond test of 3D ICs

Reliability and performance-aware 3D SRAM design

Potential Freeway Congestion Severity Measure: Impact of Continuous Congestion Patterns

Transient drain current and propagation delay in SOI CMOS

On GPU bus power reduction with 3D IC technologies

Dynamic Configuration of SSD File Management

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Fast and accurate full-chip extraction and optimization of TSV-to-wire coupling

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Practical problems in VLSI physical design automation

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Scan chain and power delivery network synthesis for pre-bond test of 3D ICs

Reliability and performance-aware 3D SRAM design

Potential Freeway Congestion Severity Measure: Impact of Continuous Congestion Patterns

Transient drain current and propagation delay in SOI CMOS

On GPU bus power reduction with 3D IC technologies

Dynamic Configuration of SSD File Management

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Fast and accurate full-chip extraction and optimization of TSV-to-wire coupling