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نمایش تعداد 1-10 از 38
Novel TSV process technologies for 2.5D/3D packaging
ناشر: IEEE
سال: 2014
Analysis of trends in the occurrence of eyeblinks for an eyeblink input interface
ناشر: IEEE
سال: 2014
Sensitivity analysis of the row model's input parameters
ناشر: IEEE
سال: 2014
Committees
ناشر: IEEE
سال: 2014
Cryptographic key issues and solutions for the bit sieve/pixel-sieve method
ناشر: IEEE
سال: 2014
Design of metamaterial-coated arrays through quasi-conformal transformation optics
ناشر: IEEE
سال: 2014
Precise time synchronization device for distributed robot system cooperation
ناشر: IEEE
سال: 2014



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