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نمایش تعداد 1-10 از 16

Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)

نوع: Conference Paper

نویسنده : Chen, Zhaohui; Jung, Boo Yang; Lim, Sharon Pei Siang; Dexter, Sorono Velez; Ho, David Soon Wee; Zhang, Xiaowu

ناشر: IEEE

سال: 2014

Sum of squares based nonlinear control design for diesel engine

نوع: Conference Paper

نویسنده : Kuzmych, Olena; Hajjaji, Ahmed El; Aitouche, Abdel; Bosche, Jerome

ناشر: IEEE

سال: 2014

The role of SDN and NFV for dynamic bandwidth allocation and QoE adaptation of video applications in home networks

نوع: Conference Paper

نویسنده : Agapiou, George; Papafili, Ioanna; Agapiou, Stelios

ناشر: IEEE

سال: 2014

A Framework for Automated Competitive Analysis of On-line Scheduling of Firm-Deadline Tasks

نوع: Conference Paper

نویسنده : Chatterjee, Krishnendu; Pavlogiannis, Andreas; Kossler, Alexander; Schmid, Ulrich

ناشر: IEEE

سال: 2014

A Computationally Inexpensive Battery Model for the Microscopic Simulation of Electric Vehicles

نوع: Conference Paper

نویسنده : Schellenberg, Sebastian; Berndt, Rudiger; Eckhoff, David; German, Reinhard

ناشر: IEEE

سال: 2014

Modelling DC offset in fault currents recorded by intelligent electronic devices

نوع: Conference Paper

نویسنده : Zivanovic, Rastko

ناشر: IEEE

سال: 2014

Adaptive Transmit Power for Wi-Fi Dense Deployments

نوع: Conference Paper

نویسنده : Chaves, Fabiano S.; Cavalcante, Andre M.; Almeida, Erika P.L.; Abinader, Fuad M.; Vieira, Robson D.; Choudhury, Sayantan; Doppler, Klaus

ناشر: IEEE

سال: 2014

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM+BEM

نوع: Conference Paper

نویسنده : Li, Zhong-zheng; Shi, Li-ming; Shi, Sheng-guo; Zhang, Song

ناشر: IEEE

سال: 2014

CPS-based hierarchical and self-similar automation architecture for the control and verification of reconfigurable manufacturing systems

نوع: Conference Paper

نویسنده : Brusaferri, Alessandro; Ballarino, Andrea; Cavadini, Franco Antonio; Manzocchi, Diego; Mazzolini, Mauro

ناشر: IEEE

سال: 2014

Multi-reflection TLP: A new measurement technique for system-level automotive ESD/EMC characterization

نوع: Conference Paper

نویسنده : Farbiz, Farzan; Salman, Akram A.

ناشر: IEEE

سال: 2014

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Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)

Sum of squares based nonlinear control design for diesel engine

The role of SDN and NFV for dynamic bandwidth allocation and QoE adaptation of video applications in home networks

A Framework for Automated Competitive Analysis of On-line Scheduling of Firm-Deadline Tasks

A Computationally Inexpensive Battery Model for the Microscopic Simulation of Electric Vehicles

Modelling DC offset in fault currents recorded by intelligent electronic devices

Adaptive Transmit Power for Wi-Fi Dense Deployments

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM+BEM

CPS-based hierarchical and self-similar automation architecture for the control and verification of reconfigurable manufacturing systems

Multi-reflection TLP: A new measurement technique for system-level automotive ESD/EMC characterization

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Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)

Sum of squares based nonlinear control design for diesel engine

The role of SDN and NFV for dynamic bandwidth allocation and QoE adaptation of video applications in home networks

A Framework for Automated Competitive Analysis of On-line Scheduling of Firm-Deadline Tasks

A Computationally Inexpensive Battery Model for the Microscopic Simulation of Electric Vehicles

Modelling DC offset in fault currents recorded by intelligent electronic devices

Adaptive Transmit Power for Wi-Fi Dense Deployments

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM&#x002B;BEM

CPS-based hierarchical and self-similar automation architecture for the control and verification of reconfigurable manufacturing systems

Multi-reflection TLP: A new measurement technique for system-level automotive ESD/EMC characterization

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM+BEM