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شبیه سازی انتقال الکترون در دیود +InAs n+ nn با ابعاد زیر میکرون با روش مونت کارلو

نوع: Conference Paper

نویسنده : محمد رضا خلوتی; هادی عربشاهی; حمید رحیم پور سلیمانی; عادله مخلص گرامی; مرتضی ایزدی فرد; Hadi Arabshahi

سال: 2009

خلاصه:

شبیه سازی انتقال الکترون در دیود InAs n nn با ابعاد زیر میکرون با روش مونت کارلو...

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

نوع: Conference Paper

نویسنده : Xie, Ling; Wickramanayaka, Sunil; Jung, Boo Yung; Li, Jerry Aw Jie; Jung-kai, Lim; Ismael, Daniel

ناشر: IEEE

سال: 2014

Modeling and Analysis of ZigBee Based Smart Home System

نوع: Conference Paper

نویسنده : Zheng, Hong; Zhang, Haiteng; Pan, Li

ناشر: IEEE

سال: 2014

Characterization of low-velocity waveguides in crosshole GPR data using amplitude analysis and full-waveform inversion

نوع: Conference Paper

نویسنده : Klotzsche, A.; van der Kruk, J.; Vereecken, H.; Bradford, J.

ناشر: IEEE

سال: 2014

Alternating driving scheme with filter circuitry for white organic light-emitting diode lighting

نوع: Conference Paper

نویسنده : Yang, Henglong; Chen, Ya-Di; Chang, Wen-Cheng

ناشر: IEEE

سال: 2014

Influence of actuator properties on learning to control a virtual limb

نوع: Conference Paper

نویسنده : Hasson, Christopher J.

ناشر: IEEE

سال: 2014

Factored solution of infeasible load flow cases

نوع: Conference Paper

نویسنده : Gomez-Exposito, Antonio; Gomez-Quiles, Catalina; Vargas, Walter

ناشر: IEEE

سال: 2014

Spectrum sensing in cognitive radio networks through change detection technique

نوع: Conference Paper

نویسنده : Sousa e Silva, M.B.; Noll Barreto, A.

ناشر: IEEE

سال: 2014

A unified controller for a microgrid based on adaptive virtual impedance and conductance

نوع: Conference Paper

نویسنده : Mao, Meiqin; Dong, Zheng; Ding, Yong; Chang, Liuchen

ناشر: IEEE

سال: 2014

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نوع: Conference Paper

ناشر: IEEE

سال: 2014

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شبیه سازی انتقال الکترون در دیود +InAs n+ nn با ابعاد زیر میکرون با روش مونت کارلو

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Modeling and Analysis of ZigBee Based Smart Home System

Characterization of low-velocity waveguides in crosshole GPR data using amplitude analysis and full-waveform inversion

Alternating driving scheme with filter circuitry for white organic light-emitting diode lighting

Influence of actuator properties on learning to control a virtual limb

Factored solution of infeasible load flow cases

Spectrum sensing in cognitive radio networks through change detection technique

A unified controller for a microgrid based on adaptive virtual impedance and conductance

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شبیه سازی انتقال الکترون در دیود +InAs n+ nn با ابعاد زیر میکرون با روش مونت کارلو

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Modeling and Analysis of ZigBee Based Smart Home System

Characterization of low-velocity waveguides in crosshole GPR data using amplitude analysis and full-waveform inversion

Alternating driving scheme with filter circuitry for white organic light-emitting diode lighting

Influence of actuator properties on learning to control a virtual limb

Factored solution of infeasible load flow cases

Spectrum sensing in cognitive radio networks through change detection technique

A unified controller for a microgrid based on adaptive virtual impedance and conductance

Copyright page