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نمایش تعداد 1-10 از 14
Innovative wafer level package manufacturing with FlexLine<sup>TM</sup>
ناشر: IEEE
سال: 2014
Wave-packet image fusion technique based on genetic algorithm
ناشر: IEEE
سال: 2014
A three stage hybrid model to perform feature level speech signal recognition
ناشر: IEEE
سال: 2014
Banquet speaker
ناشر: IEEE
سال: 2014
3D non-rigid pattern recognition based on structural analysis
ناشر: IEEE
سال: 2014
Conference committees
ناشر: IEEE
سال: 2014
High-resolution SAR signal simulation using parallel FDTD method
ناشر: IEEE
سال: 2014