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نمایش تعداد 1-10 از 108

Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

نوع: Journal Paper

نویسنده : Chih-Fan Lin; Chih-Ming Chen; Wei-Ping Dow; Hung-Hsin Liu; Ho-Chun Tien; Shih-Fu Lee; Wei-Ming Chen

ناشر: IEEE

سال: 2014

Baseband signal processing with UnetStack

نوع: Conference Paper

نویسنده : Chitre, M.; Bhatnagar, R.; Ignatius, M.; Suman, S.

ناشر: IEEE

سال: 2014

On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

نوع: Conference Paper

نویسنده : Kleider, John; Steenhoek, Chris

ناشر: IEEE

سال: 2014

Cyclic Feature Concealing CP Selection for Physical Layer Security

نوع: Conference Paper

نویسنده : Ankaral, Z.Esat; Karabacak, Murat; Arslan, Huseyin

ناشر: IEEE

سال: 2014

Generator of Ethnocultural Learning Objects for the preservation of the languages, customs and traditions indigenous

نوع: Conference Paper

نویسنده : Silva Sprock, A.; Ponce Gallegos, J.; Munoz Arteaga, J.

ناشر: IEEE

سال: 2014

Arc flash hazard reduction at incoming terminals of LV equipment

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages

نوع: Journal Paper

نویسنده : Mandic, Tvrtko; Nauwelaers, Bart K. J. C.; Baric, Adrijan

ناشر: IEEE

سال: 2014

Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module

نوع: Journal Paper

نویسنده : Wei Kexin; Du Mingxing; Xie Linlin; Li Jian

ناشر: IEEE

سال: 2014

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

نوع: Journal Paper

نویسنده : Kongjing Li; Gui Yun Tian; Liang Cheng; Aijun Yin; Wenping Cao; Crichton, Stuart

ناشر: IEEE

سال: 2014

Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film

نوع: Journal Paper

نویسنده : Kyung-Rok Kim; Chang-Wan Ha; Kyung-Soo Kim; Won-Soo Yun

ناشر: IEEE

سال: 2014

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Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

Baseband signal processing with UnetStack

On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Cyclic Feature Concealing CP Selection for Physical Layer Security

Generator of Ethnocultural Learning Objects for the preservation of the languages, customs and traditions indigenous

Arc flash hazard reduction at incoming terminals of LV equipment

Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages

Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film

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Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

Baseband signal processing with UnetStack

On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Cyclic Feature Concealing CP Selection for Physical Layer Security

Generator of Ethnocultural Learning Objects for the preservation of the languages, customs and traditions indigenous

Arc flash hazard reduction at incoming terminals of LV equipment

Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages

Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film