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نمایش تعداد 1-10 از 10

A resilient 3-D stacked multicore processor fabricated using die-level 3-D integration and backside TSV technologies

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Dopant deactivation: A new challenge in sub-20nm scaled FinFETs

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Control inercial de robot con dispositivos móviles

نوع: Conference Paper

نویسنده : Balich, N. , Cena, A. , Fransoy, A.

ناشر: IEEE

سال: 2014

A DSP HEVC decoder implementation based on OpenHEVC

نوع: Conference Paper

ناشر: IEEE

سال: 2014

List staff

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Determining the Optimal Redistribution for a Given Data Partition

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Phase Controlled Class E Amplifier Characteristics for Pulsing Applications

نوع: Journal Paper

نویسنده : Eroglu, Abdullah

ناشر: IEEE

سال: 2014

The rearrangeable nonblocking conditions in the multi-MBA(N, e, 2) switching network

نوع: Conference Paper

نویسنده : Rajewski, Remigiusz

ناشر: IEEE

سال: 2014

Vapour phase soldering on flexible printed circuit boards

نوع: Conference Paper

نویسنده : Geczy, Attila; Batorfi, Reka; Szeles, Gergely; Luhaly, Adam; Ruszinko, Miklos; Berenyi, Richard

ناشر: IEEE

سال: 2014

Peak-Efficiency Detection and Peak-Efficiency Tracking Algorithm for Switched-Mode DC–DC Power Converters

نوع: Journal Paper

نویسنده : Michal, V.

ناشر: IEEE

سال: 2014

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A resilient 3-D stacked multicore processor fabricated using die-level 3-D integration and backside TSV technologies

Dopant deactivation: A new challenge in sub-20nm scaled FinFETs

Control inercial de robot con dispositivos móviles

A DSP HEVC decoder implementation based on OpenHEVC

List staff

Determining the Optimal Redistribution for a Given Data Partition

Phase Controlled Class E Amplifier Characteristics for Pulsing Applications

The rearrangeable nonblocking conditions in the multi-MBA(N, e, 2) switching network

Vapour phase soldering on flexible printed circuit boards

Peak-Efficiency Detection and Peak-Efficiency Tracking Algorithm for Switched-Mode DC–DC Power Converters

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A resilient 3-D stacked multicore processor fabricated using die-level 3-D integration and backside TSV technologies

Dopant deactivation: A new challenge in sub-20nm scaled FinFETs

Control inercial de robot con dispositivos m&#x00F3;viles

A DSP HEVC decoder implementation based on OpenHEVC

List staff

Determining the Optimal Redistribution for a Given Data Partition

Phase Controlled Class E Amplifier Characteristics for Pulsing Applications

The rearrangeable nonblocking conditions in the multi-MBA(N, e, 2) switching network

Vapour phase soldering on flexible printed circuit boards

Peak-Efficiency Detection and Peak-Efficiency Tracking Algorithm for Switched-Mode DC&#x2013;DC Power Converters

Control inercial de robot con dispositivos móviles

Peak-Efficiency Detection and Peak-Efficiency Tracking Algorithm for Switched-Mode DC–DC Power Converters