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نمایش تعداد 1-10 از 321

Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor

نوع: Conference Paper

نویسنده : Chia-Chen Kuo , Jenn-Ming Song

ناشر: IEEE

سال: 2014

Novel metrology and wafer grinder technologies combine for improved capability for TSV structures

نوع: Conference Paper

ناشر: IEEE

سال: 2014

A new non-isolated multi-output converter with four outputs from two switches

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Hardware virtualization based security solution for embedded systems

نوع: Conference Paper

ناشر: IEEE

سال: 2014

An InGaAs/InP quantum well finfet using the replacement fin process integrated in an RMG flow on 300mm Si substrates

نوع: Conference Paper

ناشر: IEEE

سال: 2014

3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Adaptive partitioning strategies for loop parallelism in heterogeneous architectures

نوع: Conference Paper

ناشر: IEEE

سال: 2014

DfST: Design for secure testability

نوع: Conference Paper

نویسنده : Saeed, Samah Mohamed

ناشر: IEEE

سال: 2014

An algorithm to extract the generalized physical contradiction

نوع: Conference Paper

نویسنده : Lei Lin , Dubois, S. , De Guio, R. , Rasovska, I.

ناشر: IEEE

سال: 2014

Collaboration in the Absence of Communication

نوع: Conference Paper

نویسنده : Bendix, L.; Pendleton, C.

ناشر: IEEE

سال: 2014

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Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor

Novel metrology and wafer grinder technologies combine for improved capability for TSV structures

A new non-isolated multi-output converter with four outputs from two switches

Hardware virtualization based security solution for embedded systems

An InGaAs/InP quantum well finfet using the replacement fin process integrated in an RMG flow on 300mm Si substrates

3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package

Adaptive partitioning strategies for loop parallelism in heterogeneous architectures

DfST: Design for secure testability

An algorithm to extract the generalized physical contradiction

Collaboration in the Absence of Communication

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Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor

Novel metrology and wafer grinder technologies combine for improved capability for TSV structures

A new non-isolated multi-output converter with four outputs from two switches

Hardware virtualization based security solution for embedded systems

An InGaAs/InP quantum well finfet using the replacement fin process integrated in an RMG flow on 300mm Si substrates

3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package

Adaptive partitioning strategies for loop parallelism in heterogeneous architectures

DfST: Design for secure testability

An algorithm to extract the generalized physical contradiction

Collaboration in the Absence of Communication