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Author : Abouzeid, Fady; Bienfait, Audrey; Akyel, Kaya Can; Feki, Afef; Clerc, Sylvain; Ciampolini, L.; Giner, F.; Wilson, Richard; Roche, Philippe

Publisher: IEEE

Year: 2014

Improved Thermal Performance of SOI Using a Compound Buried Layer

Type: Journal Paper

Author : Baine, P.; Montgomery, John H.; Armstrong, B. Mervyn; Gamble, Harold S.; Harrington, Sarah J.; Nigrin, Sydney; Wilson, Richard; Oo, Kean B.; Armstrong, Alastair G.; Suder, Suli

Publisher: IEEE

Year: 2014

A Fine-Grain Variation-Aware Dynamic <formula formulatype="inline"> <img src="/images/tex/21458.gif" alt="{\\rm Vdd}"> </formula>-Hopping AVFS Architecture on a 32 nm GALS MPSoC

Type: Journal Paper

Author : Miro-Panades, Ivan; Beigne, Edith; Thonnart, Yvain; Alacoque, Laurent; Vivet, Pascal; Lesecq, Suzanne; Puschini, Diego; Molnos, Anca; Thabet, Farhat; Tain, Benoit; Ben Chehida, Karim; Engels, S.; Wilson, Richard; Fuin, D.

Publisher: IEEE

Year: 2014

Untitled

Type: Journal Paper

Author : McClelland, Michael; Sanderson, Kenneth E.; Spieth, John; Clifton, Sandra W.; Latreille, Phil; Courtney, Laura; Porwollik, Steffen; Ali, Johar; Dante, Mike; Du, Feiyu; Hou, Shunfang; Layman, Dan; Leonard, Shawn; Nguyen, Christine; Scott, Kelsi; Holmes, Andrea; Grewal, Neenu; Mulvaney, Elizabeth; Ryan, Ellen; Sun, Hui; Florea, Liliana; Miller, Webb; Stoneking, Tamberlyn; Nhan, Michael; Waterston, Robert; Wilson, Richard K.

Year: 2001

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A 3 GHz Dual Core Processor ARM Cortex TM -A9 in 28 nm UTBB FD-SOI CMOS With Ultra-Wide Voltage Range and Energy Efficiency Optimization

Type: Journal Paper

Author : Jacquet, D.; Hasbani, Frederic; Flatresse, Philippe; Wilson, Richard; Arnaud, F.; Cesana, G.; Di Gilio, Thierry; Lecocq, Claire; Roy, Tonmoy; Chhabra, Amit; Grover, Claire; Minez, Olivier; Uginet, Jacky; Durieu, Guy; Adobati, Cyril; Casalotto, Davide; Nyer, Frederic; Menut, Patrick; Cathelin, A.; Vongsavady, Indavong; Magarshack, P.

Publisher: IEEE

Year: 2014

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Political culture and the persistence of inequality

Mechanisms of Nutrient Acquisition and Utilization During Fungal Infections of Leaves

Under pressure: investigating the biology of plant infection by Magnaporthe oryzae

Spherical and Hyperbolic Embeddings of Data

Seamless texture stitching on a 3D mesh by poisson blending in patches

Scalable 0.35 V to 1.2 V SRAM Bitcell Design From 65 nm CMOS to 28 nm FDSOI

Improved Thermal Performance of SOI Using a Compound Buried Layer

A Fine-Grain Variation-Aware Dynamic <formula formulatype="inline"> <img src="/images/tex/21458.gif" alt="{\\rm Vdd}"> </formula>-Hopping AVFS Architecture on a 32 nm GALS MPSoC

Untitled

A 3 GHz Dual Core Processor ARM Cortex TM -A9 in 28 nm UTBB FD-SOI CMOS With Ultra-Wide Voltage Range and Energy Efficiency Optimization

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Political culture and the persistence of inequality

Mechanisms of Nutrient Acquisition and Utilization During Fungal Infections of Leaves

Under pressure: investigating the biology of plant infection by Magnaporthe oryzae

Spherical and Hyperbolic Embeddings of Data

Seamless texture stitching on a 3D mesh by poisson blending in patches

Scalable 0.35 V to 1.2 V SRAM Bitcell Design From 65 nm CMOS to 28 nm FDSOI

Improved Thermal Performance of SOI Using a Compound Buried Layer

A Fine-Grain Variation-Aware Dynamic <formula formulatype="inline"> <img src="/images/tex/21458.gif" alt="{\\rm Vdd}"> </formula>-Hopping AVFS Architecture on a 32 nm GALS MPSoC

Untitled

A 3 GHz Dual Core Processor ARM Cortex TM -A9 in 28 nm UTBB FD-SOI CMOS With Ultra-Wide Voltage Range and Energy Efficiency Optimization