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Effects of wave steepness and relative water depth on wave attenuation by emergent vegetation

Type: Journal Paper

Author : Wei-Cheng Wu; Daniel T. Cox

Year: 2015

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Risk evaluation of green components to hazardous substance using FMEA and FAHP

Type: Journal Paper

Author : Allen H. Hu; Chia-Wei Hsu; Tsai-Chi Kuo; Wei-Cheng Wu

Publisher: Elsevier Science

Year: 2009

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Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM)

Type: Journal Paper

Author : Meng-Fan Chang; Pi-Feng Chiu; Wei-Cheng Wu; Ching-Hao Chuang; Shyh-Shyuan Sheu

Year: 2011

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A 130 mV SRAM With Expanded Write and Read Margins for Subthreshold Applications

Type: Journal Paper

Author : Meng-Fan Chang; Shi-Wei Chang; Po-Wei Chou; Wei-Cheng Wu

Year: 2011

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Aptamer-Conjugated Polymeric Nanoparticles for the Detection of Cancer Cells through “Turn-on” Retro-Self-Quenched Fluorescence

Type: Journal Paper

Author : Lin-Chen Ho; Wei-Cheng Wu; Chang-Yu Chang; Hao-Hsuan Hsieh; Ching-Hsiao Lee; Huan-Tsung Chang

Year: 2015

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Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications

Type: Journal Paper

Author : Chin-Te Wang; Li-Han Hsu; Wei-Cheng Wu; Heng-Tung Hsu; Chang, Edward Yi; Yin-Chu Hu; Ching-Ting Lee; Szu-Ping Tsai

Publisher: IEEE

Year: 2014

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Effects of wave steepness and relative water depth on wave attenuation by emergent vegetation

Risk evaluation of green components to hazardous substance using FMEA and FAHP

Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM)

A 130 mV SRAM With Expanded Write and Read Margins for Subthreshold Applications

Aptamer-Conjugated Polymeric Nanoparticles for the Detection of Cancer Cells through “Turn-on” Retro-Self-Quenched Fluorescence

Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications

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Effects of wave steepness and relative water depth on wave attenuation by emergent vegetation

Risk evaluation of green components to hazardous substance using FMEA and FAHP

Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM)

A 130 mV SRAM With Expanded Write and Read Margins for Subthreshold Applications

Aptamer-Conjugated Polymeric Nanoparticles for the Detection of Cancer Cells through “Turn-on” Retro-Self-Quenched Fluorescence

Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications