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A 150 MS/s 133W 7 bit ADC in 90 nm Digital CMOS

Type: Journal Paper

Author : Van der Plas, G.; Verbruggen, B.

Year: 2008

A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a

Type: Journal Paper

Author : Ryckaert, J.; Van der Plas, G.; De Heyn, V.; Desset, C.; Van Poucke, B.; Craninckx, J.

Year: 2007

Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements

Type: Conference Paper

Author : De Wolf, I.; Lofrano, M.; Simons, V.; Cherman, V.; De Vos, J.; Van der Plas, G.; Beyne, E.

Publisher: IEEE

Year: 2014

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

Type: Journal Paper

Author : Araga, Yuuki; Nagata, M.; Van der Plas, G.; Marchal, P.; Libois, M.; La Manna, A.; Wenqi Zhang; Beyer, G.; Beyne, Eric

Publisher: IEEE

Year: 2014

Author

Van der Plas, G. (4)

Araga, Yuuki (1)

Beyer, G. (1)

Beyne, E. (1)

Beyne, Eric (1)

Cherman, V. (1)

Craninckx, J. (1)

De Heyn, V. (1)

De Vos, J. (1)

De Wolf, I. (1)

Publisher

IEEE (2)

Year

2014 (2)

2008 (1)

2007 (1)

Keywords

3D IC demonstrator (1)

capacitance (1)

cloud computing (1)

CMOS integrated circuits (1)

CMOS technology (1)

digital noise source circuits (1)

electric impedance (1)

equivalent circuit (1)

equivalent circuits (1)

frequency-domain response (1)

Type

Journal Paper (3)

Conference Paper (1)

Language (ISO)

English (4)

Content Type

Fulltext (2)

Metadata Only (2)

Publication Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on (1)

lectronics System-Integration Technology Conference (ESTC), 2014 (1)

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