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RISElectromigration induced failure of solder bumps and the role of IMC
Publisher: IEEE
Year: 2014
Spray pyrolysis deposition for gas sensor integration in the backend of standard CMOS processes
Publisher: IEEE
Year: 2014
Electromigration reliability of solder bumps
Publisher: IEEE
Year: 2014
Spin diffusion and the role of screening effects in semiconductors
Publisher: IEEE
Year: 2014
Efficient calculation of the two-dimensional Wigner potential
Publisher: IEEE
Year: 2014
Spin lifetime in strained silicon films
Publisher: IEEE
Year: 2014
The Wigner Monte Carlo method for accurate semiconductor device simulation
Publisher: IEEE
Year: 2014
Implications of the coherence length on the discrete Wigner potential
Publisher: IEEE
Year: 2014
Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs
Publisher: IEEE
Year: 2014