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Now showing items 1-7 of 7

High-efficiency horn antenna using solder balls for seamless package with millimeter-wave 3D chips

Type: Conference Paper

Author : Sanming Hu , Menzel, W. , Waldschmidt, C.

Publisher: IEEE

Year: 2014

A high-sensitivity 135GHz millimeter-wave imager by differential transmission-line loaded split-ring-resonator in 65nm CMOS

Type: Conference Paper

Author : Yang Shang; Hao Yu; Chang Yang; Sanming Hu; Minkyu Je

Publisher: IEEE

Year: 2014

Built-in-Self-Test-Stacked 3-D Ring Oscillator Based on Through Silicon Vias

Type: Journal Paper

Author : Cheng Jin; Yunjie Li; Rui Li; Sanming Hu; Liang Ding; Hongyu Li; Songbai Zhang

Year: 2015

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Self-Shielded Circularly Polarized Antenna-in-Package Based on Quarter Mode Substrate Integrated Waveguide Subarray

Type: Journal Paper

Author : Cheng Jin; Rui Li; Sanming Hu; Songbai Zhang; Ka Fai Chang; Boyu Zheng

Publisher: IEEE

Year: 2014

High-Sensitivity CMOS Super-Regenerative Receiver with Quench-Controlled High-<formula formulatype="inline"> <img src="/images/tex/228.gif" alt="Q"> </formula> Metamaterial Resonator for Millimeter-Wave Imaging at 96 and 135 GHz

Type: Journal Paper

Author : Yang Shang; Hao Yu; Sanming Hu; Yuan Liang; Xiaojun Bi; Arasu, M.A.

Publisher: IEEE

Year: 2014

D-band on-chip higher-order-mode dielectric-resonator antennas fed by half-mode cavity in CMOS technology

Type: Journal Paper

Author : Debin Hou; Wei Hong; Wang-Ling Goh; Jixin Chen; Yong-Zhong Xiong; Sanming Hu; Madihian, Mohammad

Publisher: IEEE

Year: 2014

Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

Type: Journal Paper

Author : Sanming Hu; Cheng Jin; Hongyu Li; Rui Li; Ser Choong Chong; Ming Chinq Jong; Wai, Eva Leong Ching; Keng Hwa Teo; Minkyu Je; Lo, Patrick Guo Qiang

Publisher: IEEE

Year: 2014

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High-efficiency horn antenna using solder balls for seamless package with millimeter-wave 3D chips

A high-sensitivity 135GHz millimeter-wave imager by differential transmission-line loaded split-ring-resonator in 65nm CMOS

Built-in-Self-Test-Stacked 3-D Ring Oscillator Based on Through Silicon Vias

Self-Shielded Circularly Polarized Antenna-in-Package Based on Quarter Mode Substrate Integrated Waveguide Subarray

High-Sensitivity CMOS Super-Regenerative Receiver with Quench-Controlled High-<formula formulatype="inline"> <img src="/images/tex/228.gif" alt="Q"> </formula> Metamaterial Resonator for Millimeter-Wave Imaging at 96 and 135 GHz

D-band on-chip higher-order-mode dielectric-resonator antennas fed by half-mode cavity in CMOS technology

Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

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High-efficiency horn antenna using solder balls for seamless package with millimeter-wave 3D chips

A high-sensitivity 135GHz millimeter-wave imager by differential transmission-line loaded split-ring-resonator in 65nm CMOS

Built-in-Self-Test-Stacked 3-D Ring Oscillator Based on Through Silicon Vias

Self-Shielded Circularly Polarized Antenna-in-Package Based on Quarter Mode Substrate Integrated Waveguide Subarray

High-Sensitivity CMOS Super-Regenerative Receiver with Quench-Controlled High-<formula formulatype="inline"> <img src="/images/tex/228.gif" alt="Q"> </formula> Metamaterial Resonator for Millimeter-Wave Imaging at 96 and 135 GHz

D-band on-chip higher-order-mode dielectric-resonator antennas fed by half-mode cavity in CMOS technology

Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain