Search

Author : Thrivikraman, Tushar; Patterson, Chad E.; Coen, Chris; Yepes, Ana M.; Papapolymerou, John; Cressler, John D.; Heath, Ted; Wilson, Bill

Year: 2013

Request PDF

A Low-Loss and High Isolation D-Band SPDT Switch Utilizing Deep-Saturated SiGe HBTs

Type: Journal Paper

Author : Ulusoy, /A/. Cagri; Song, Peter; Schmid, Robert L.; Khan, Wasif T.; Kaynak, Mehmet; Tillack, Bernd; Papapolymerou, John; Cressler, John D.

Publisher: IEEE

Year: 2014

Compact, low-power, single-ended and differential SiGe W-band LNAs

Type: Conference Paper

Author : Inanlou, Farzad; Khan, Wasif; Song, Peter; Zeinolabedinzadeh, Saeed; Schmid, Robert L.; Chi, Taiyun; Ulusoy, Ahmet C.; Papapolymerou, John; Wang, Hua; Cressler, John D.

Publisher: IEEE

Year: 2014

Search

Editorial

Editorial

Planar Realization of a Triple-Mode Bandpass Filter Using a Multilayer Configuration

Reconfigurable RF MEMS Phased Array Antenna Integrated Within a Liquid Crystal Polymer (LCP) System-on-Package

A 60-GHz CPW-Fed High-Gain and Broadband Integrated Horn Antenna

Packaging a <formula formulatype="inline"> <img src="/images/tex/473.gif" alt="W"> </formula>-Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic Substrate

An ultra-wideband, hybrid, distributed power amplifier using flip-chip bonded GaN devices on AlN substrate

Integrated, digitally controlled, 64-element SiGe on multilayer organic X-band phased-array receiver antenna for snow measurements

A Low-Loss and High Isolation D-Band SPDT Switch Utilizing Deep-Saturated SiGe HBTs

Compact, low-power, single-ended and differential SiGe W-band LNAs

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Editorial

Editorial

Planar Realization of a Triple-Mode Bandpass Filter Using a Multilayer Configuration

Reconfigurable RF MEMS Phased Array Antenna Integrated Within a Liquid Crystal Polymer (LCP) System-on-Package

A 60-GHz CPW-Fed High-Gain and Broadband Integrated Horn Antenna

Packaging a <formula formulatype="inline"> <img src="/images/tex/473.gif" alt="W"> </formula>-Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic Substrate

An ultra-wideband, hybrid, distributed power amplifier using flip-chip bonded GaN devices on AlN substrate

Integrated, digitally controlled, 64-element SiGe on multilayer organic X-band phased-array receiver antenna for snow measurements

A Low-Loss and High Isolation D-Band SPDT Switch Utilizing Deep-Saturated SiGe HBTs

Compact, low-power, single-ended and differential SiGe W-band LNAs