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Fabrication and reliability evaluation of a novel package-on-package (PoP) structure based on organic substrate

Type: Conference Paper

Author : Xiaofeng Sun , Lixi Wan , Yuan Lu

Publisher: IEEE

Year: 2014

Fabrication of ZnO nanogenerator potentially to be embedded in flexible printed circuit board

Type: Conference Paper

Author : Yanbiao Chu; Lixi Wan; Xueping Guo; Zhongyao Yu

Publisher: IEEE

Year: 2014

Development of through glass tungsten via interconnect for 3D MEMS packaging

Type: Journal Paper

Author : Yu Sun; Daquan Yu; Shuangshou Yang; Xiaofeng Sun; Jing Zhang; Xiuzhen Wei; Lixi Wan

Year: 2011

Analysis on electromagnetic isolation issues among multi-chips in system in package

Type: Conference Paper

Author : Peng Wu; Fengman Liu; Yi He; Huimin He; Jun Li; Liqiang Cao; Dongkai Shangguan; Lixi Wan

Publisher: IEEE

Year: 2014

A study of high-density embedded capacitor for silicon-substrate package

Type: Journal Paper

Author : Huijuan Wang; Fengwei Dai; Daniel Guidotti; Yao Lv; Liqiang Cao; Lixi Wan

Year: 2010

Author

Lixi Wan (4)

Liqiang Cao (2)

Daniel Guidotti (1)

Daquan Yu (1)

Dongkai Shangguan (1)

Fengman Liu (1)

Fengwei Dai (1)

Huijuan Wang (1)

Huimin He (1)

Jing Zhang (1)

Publisher

IEEE (3)

Year

2014 (3)

2011 (1)

2010 (1)

Keywords

Algorithm design and analysis (1)

cache tuning (1)

Conferences (1)

configurable caches (1)

Databases (1)

Design space exploration (1)

design space subsetting (1)

Electronic mail (1)

Energy consumption (1)

HRMS (1)

Type

Conference Paper (3)

Journal Paper (2)

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English (5)

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Metadata Only (3)

Fulltext (2)

Publication Title

lectronic Packaging Technology (ICEPT), 2014 15th International Conference on (2)

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (1)

2011 IEEE 13th Electronics Packaging Technology Conference (1)

lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th (1)

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