Search

English
- Persian
- English
Login

Ferdowsi University of Mashhad
|
Information Center and Central Library

- Persian
- English

Home
Source Types
- Journal Paper
- Ebook
- Conference Paper
- Standard
- Protocol
- Thesis
Use Help

FUM Digital Library
Search

FUM Digital Library
Search

All Fields
Title
Author
Year
Publisher
Subject
Publication Title
ISSN
DOI
ISBN

Advanced Search

JavaScript is disabled for your browser. Some features of this site may not work without it.

Search

Show Advanced Filters Hide Advanced Filters

Filters

Use filters to refine the search results.

Now showing items 1-2 of 2

Relevance
Title Asc
Title Desc
Year Asc
Year Desc

5
10
20
40
60
80
100

CSV
RIS

Sort Options:
Relevance
Title Asc
Title Desc
Issue Date Asc
Issue Date Desc
Results Per Page:
5
10
20
40
60
80
100

Alternative package-on-package with organic substrate interposer for stacking packaging solution

Type: Conference Paper

Author : Lin, Steven; Liao, Mark; Lan, Albert; Wang, David

Publisher: IEEE

Year: 2014

Structure reliability and characterization for FC package w/Embedded Trace coreless Substrate

Type: Conference Paper

Author : Chen, Eason; Lan, Albert; You, Jack; Liao, Mark

Publisher: IEEE

Year: 2014

Author

Lan, Albert (2)

Liao, Mark (2)

Chen, Eason (1)

Lin, Steven (1)

Wang, David (1)

You, Jack (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

Annealing (1)

n Application specific integrated circuits (1)

n backtracking (1)

n Biological cells (1)

n Hardware (1)

n Hardware Software Codeign optimization (1)

n label setting (1)

n label-correction (1)

n Location (1)

n Partitioning (1)

Type

Conference Paper (2)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (2)

About Us

نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش

DSpace software copyright © 2019-2022 DuraSpace