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Alternative package-on-package with organic substrate interposer for stacking packaging solution

Type: Conference Paper

Author : Lin, Steven; Liao, Mark; Lan, Albert; Wang, David

Publisher: IEEE

Year: 2014

Structure reliability and characterization for FC package w/Embedded Trace coreless Substrate

Type: Conference Paper

Author : Chen, Eason; Lan, Albert; You, Jack; Liao, Mark

Publisher: IEEE

Year: 2014

Flip chip packaging with pre-molded coreless substrate

Type: Conference Paper

Author : Tang, Tom; Lan, Albert; Tsai, Jensen; Chang, Ivan; Chen, Evan

Publisher: IEEE

Year: 2014

Author

Lan, Albert (3)

Liao, Mark (2)

Chang, Ivan (1)

Chen, Eason (1)

Chen, Evan (1)

Lin, Steven (1)

Tang, Tom (1)

Tsai, Jensen (1)

Wang, David (1)

You, Jack (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

Annealing (1)

diseases (1)

n acquired signal filtrations (1)

n Application specific integrated circuits (1)

n automatic removal (1)

n backtracking (1)

n Biological cells (1)

n c (1)

n ECG abnormalities (1)

n ECG parameter variations (1)

Type

Conference Paper (3)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (3)

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