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Photonic–Electronic Integration With Bonding

Type: Journal Paper

Author : Fedeli, J.-M.; Schrank, Franz; Augendre, E.; Bernabe, S.; Kraft, J.; Grosse, P.; Enot, T.

Publisher: IEEE

Year: 2014

Manufacturing of 3D integrated sensors and circuits

Type: Conference Paper

Author : Schrems, M.; Siegert, J.; Dorfi, P.; Kraft, J.; Stueckler, E.; Schrank, F.; Selberherr, S.

Publisher: IEEE

Year: 2014

Through Silicon Via Reliability

Type: Journal Paper

Author : Cassidy, C.; Kraft, J.; Carniello, S.; Roger, F.; Ceric, H.; Singulani, A.P.; Langer, E.; Schrank, F.

Publisher: IEEE

Year: 2012

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Local residual stresses in tungsten coated TSVs characterized by synchrotron X-ray nanodiffraction and Raman spectroscopy

Type: Conference Paper

Author : Defregger, S.; Steffenelli, M.; Deluca, M.; Maier, G.; Sartory, B.; Burghammer, M.; Kraft, J.; Carniello, S.; Keckes, J.

Publisher: IEEE

Year: 2014

Modeling the Growth of Tin Dioxide Using Spray Pyrolysis Deposition for Gas Sensor Applications

Type: Journal Paper

Author : Filipovic, Lado; Selberherr, Siegfried; Mutinati, Giorgio C.; Brunet, Elise; Steinhauer, Stephan; Kock, Alexander; Teva, Jordi; Kraft, J.; Siegert, Joerg; Schrank, Franz; Gspan, Christian; Grogger, Werner

Publisher: IEEE

Year: 2014

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Photonic–Electronic Integration With Bonding

Manufacturing of 3D integrated sensors and circuits

Through Silicon Via Reliability

Local residual stresses in tungsten coated TSVs characterized by synchrotron X-ray nanodiffraction and Raman spectroscopy

Modeling the Growth of Tin Dioxide Using Spray Pyrolysis Deposition for Gas Sensor Applications

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Photonic&#x2013;Electronic Integration With Bonding

Manufacturing of 3D integrated sensors and circuits

Through Silicon Via Reliability

Local residual stresses in tungsten coated TSVs characterized by synchrotron X-ray nanodiffraction and Raman spectroscopy

Modeling the Growth of Tin Dioxide Using Spray Pyrolysis Deposition for Gas Sensor Applications

Photonic–Electronic Integration With Bonding