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Now showing items 1-10 of 11

Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Type: Journal Paper

Author : Song, Eunseok; Koo, Kyoungchoul; Pak, Jun So; Kim, Joungho

Year: 2013

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Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC

Type: Conference Paper

Author : Song, Eunseok; Jung, Daniel H.; Kim, Youngwoo; Kim, Joungho

Publisher: IEEE

Year: 2014

Harmonic current reduction method of hand-held resonant magnetic field charger (HH-RMFC) for electric vehicle

Type: Conference Paper

Author : Song, Chiuk; Kim, Hongseok; Jung, Daniel H.; Song, Eunseok; Kim, Sukjin; Kim, Jonghoon; Kim, Joungho

Publisher: IEEE

Year: 2014

Electromagnetic radiated emissions from a wireless power transfer system using a resonant magnetic field coupling

Type: Conference Paper

Author : Kong, Sunkyu; Kim, Jonghoon; Bae, Bumhee; Kim, Jonghoon J.; Kim, Sukjin; Kim, Joungho

Publisher: IEEE

Year: 2014

Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling

Type: Conference Paper

Author : Kim, Sukjin; Cho, Yeonje; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Kim, Joungho

Publisher: IEEE

Year: 2014

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Type: Conference Paper

Author : Kim, Youngwoo; Cho, Kiyeong Kim Jonghyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao

Publisher: IEEE

Year: 2014

Electromagnetic interference and radiation from wireless power transfer systems

Type: Conference Paper

Author : Kim, Jonghoon; Kim, Hongseok; Song, Chiuk; Kim, In-Myoung; Kim, Young-il; Kim, Joungho

Publisher: IEEE

Year: 2014

Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

Type: Conference Paper

Author : Song, Jinwook; Kim, Sukjin; Bae, Bumhee; Kim, Jonghoon J.; Jung, Daniel H.; Kim, Joungho

Publisher: IEEE

Year: 2014

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Type: Journal Paper

Author : Kim, Jiseong; Kim, Jonghoon; Kong, Sunkyu; Kim, Hongseok; Suh, In-Soo; Suh, Nam Pyo; Cho, Dong-Ho; Kim, Joungho; Ahn, Seungyoung

Year: 2013

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Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing

Type: Conference Paper

Author : Lee, Eunjung; Lee, Manho; Kim, Jonghoon J.; Kim, Mijoo; Kim, Jonghoon; Kim, Joungho; Park, Jeoungkun; Joo, Younghoon; Bang, Yoonhee; Kim, Il; Nam, Seungki

Publisher: IEEE

Year: 2014

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Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC

Harmonic current reduction method of hand-held resonant magnetic field charger (HH-RMFC) for electric vehicle

Electromagnetic radiated emissions from a wireless power transfer system using a resonant magnetic field coupling

Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Electromagnetic interference and radiation from wireless power transfer systems

Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing

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Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC

Harmonic current reduction method of hand-held resonant magnetic field charger (HH-RMFC) for electric vehicle

Electromagnetic radiated emissions from a wireless power transfer system using a resonant magnetic field coupling

Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Electromagnetic interference and radiation from wireless power transfer systems

Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing