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Now showing items 1-7 of 7

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Type: Journal Paper

Author : Zhenzhen Shen; Kun Fang; Johnson, R. Wayne; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique

Type: Journal Paper

Author : Stegeman, Thomas; Pfeiffenberger, Alexander H.; Bailey, J.P.; Hamilton, Michael C.

Publisher: IET

Year: 2014

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Type: Journal Paper

Author : Pingye Xu; Pfeiffenberger, Alexander H.; Ellis, Charles D.; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

Efficient Determination of Copper Electroplating Chemistry Additives

Type: Journal Paper

Author : Ellis, Charles D.; Hamilton, Michael C.; Nakamura, James R.; Wilamowski, Bogdan M.

Publisher: IEEE

Year: 2014

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

Type: Journal Paper

Author : Pingye Xu; Fei Tong; Davis, Virginia /A/.; Minseo Park; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

High-frequency reverse-time chaos generation using digital chaotic maps

Type: Journal Paper

Author : Bailey, J.P.; Beal, A.N.; Dean, Robert N.; Hamilton, Michael C.; Tugnait, Jitendra K.

Publisher: IET

Year: 2014

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping

Type: Journal Paper

Author : Modic, Aaron; Gang Liu; Ahyi, Ayayi C.; Yuming Zhou; Pingye Xu; Hamilton, Michael C.; Williams, John R.; Feldman, L.C.; Dhar, Sudipta

Publisher: IEEE

Year: 2014

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Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Efficient Determination of Copper Electroplating Chemistry Additives

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

High-frequency reverse-time chaos generation using digital chaotic maps

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping

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Characterization of Bi&#x2013;Ag&#x2013;X Solder for High Temperature SiC Die Attach

Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Efficient Determination of Copper Electroplating Chemistry Additives

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

High-frequency reverse-time chaos generation using digital chaotic maps

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach