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Dielectric properties of polyimide/boron nitride nanocomposites at high temperature

Type: Conference Paper

Author : Diaham, S.; Saysouk, F.; Locatelli, M.-L.; Lebey, T.

Publisher: IEEE

Year: 2014

Detection of joule heating in polyimide films at high electric field and high temperature by infrared thermography

Type: Conference Paper

Author : Diaham, S.; Belijar, G.; Locatelli, M.-L.; Lebey, T.

Publisher: IEEE

Year: 2014

Thermal breakdown modeling in polyimide films considering different conduction models

Type: Conference Paper

Author : Diaham, S.; Malec, D.; Mary, D.; Locatelli, M.-L.

Publisher: IEEE

Year: 2014

Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging

Type: Journal Paper

Author : Locatelli, M.-L.; Khazaka, Rami; Diaham, S.; Cong-Duc Pham; Bechara, M.; Dinculescu, Sorin; Bidan, Pierre

Publisher: IEEE

Year: 2014

Author

Diaham, S. (4)

Locatelli, M.-L. (4)

Lebey, T. (2)

Bechara, M. (1)

Belijar, G. (1)

Bidan, Pierre (1)

Cong-Duc Pham (1)

Dinculescu, Sorin (1)

Khazaka, Rami (1)

Malec, D. (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

AC-DC power convertors (1)

air ambient tests (1)

CMOS digital integrated circuits (1)

dielectric properties (1)

Dielectrics (1)

distributed power generation (1)

elastomer insulator (1)

Electrodes (1)

encapsulation material (1)

Frequency measurement (1)

Type

Conference Paper (3)

Journal Paper (1)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

lectrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on (3)

Power Electronics, IEEE Transactions on (1)

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