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Now showing items 1-7 of 7

Tensile strength and the mining of black holes

Type: Journal Paper

Author : Brown A.R.

Publisher: American Physical Society

Year: 2013

3D coupled electro-thermal simulations for SOI FinFET with statistical variations including the fin shape dependence of the thermal conductivity

Type: Conference Paper

Author : Wang, L.; Brown, A.R.; Nedjalkov, M.; Alexander, C.; Cheng, B.; Millar, C.; Asenov, A.

Publisher: IEEE

Year: 2014

3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity

Type: Conference Paper

Author : Wang, L.; Brown, A.R.; Nedjalkov, M.; Alexander, C.; Cheng, B.; Millar, C.; Asenov, A.

Publisher: IEEE

Year: 2014

Accurate simulations of the interplay between process and statistical variability for nanoscale FinFET-based SRAM cell stability

Type: Conference Paper

Author : Xingsheng Wang; Binjie Cheng; Brown, A.R.; Millar, C.; Asenov, A.

Publisher: IEEE

Year: 2014

Inverse Scaling Trends for Charge-Trapping-Induced Degradation of FinFETs Performance

Type: Journal Paper

Author : Amoroso, S.M.; Georgiev, V.P.; Gerrer, L.; Towie, E.; Xingsheng Wang; Riddet, C.; Brown, A.R.; Asenov, A.

Publisher: IEEE

Year: 2014

Predictive simulation of future CMOS technologies and their impact on circuits

Type: Conference Paper

Author : Asenov, A.; Cheng, B.; Adamu-Lema, F.; Shifren, L.; Sinha, S.; Riddet, C.; Alexander, C.; Brown, A.R.; Wang, X.; Amoroso, S.M.

Publisher: IEEE

Year: 2014

Simultaneous simulation of systematic and stochastic process variations

Type: Conference Paper

Author : Lorenz, J.; Bar, E.; Burenkov, A.; Evanschitzky, P.; Asenov, A.; Wang, L.; Wang, X.; Brown, A.R.; Millar, C.; Reid, D.

Publisher: IEEE

Year: 2014

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Tensile strength and the mining of black holes

3D coupled electro-thermal simulations for SOI FinFET with statistical variations including the fin shape dependence of the thermal conductivity

3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity

Accurate simulations of the interplay between process and statistical variability for nanoscale FinFET-based SRAM cell stability

Inverse Scaling Trends for Charge-Trapping-Induced Degradation of FinFETs Performance

Predictive simulation of future CMOS technologies and their impact on circuits

Simultaneous simulation of systematic and stochastic process variations

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Tensile strength and the mining of black holes

3D coupled electro-thermal simulations for SOI FinFET with statistical variations including the fin shape dependence of the thermal conductivity

3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity

Accurate simulations of the interplay between process and statistical variability for nanoscale FinFET-based SRAM cell stability

Inverse Scaling Trends for Charge-Trapping-Induced Degradation of FinFETs Performance

Predictive simulation of future CMOS technologies and their impact on circuits

Simultaneous simulation of systematic and stochastic process variations