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    Benzo-cyclo-butene bonding process with 'stamp' printing for wafer level package 

    Type: Journal Paper
    Author : Wen Xia; Lei Li; Kangfa Deng; Song Li; Weiguo Su; Wei Zhang
    Publisher: IET
    Year: 2014

    Influence of gadolinium doping on the crystalline structure and optical properties of zinc oxide thin films 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Electrical obsolescence management: How to spend $1B efficiently 

    Type: Conference Paper
    Author : Pragale, Ritchie; Bakhsh, Ahmed; Patel, Amar; Apps, Neil
    Publisher: IEEE
    Year: 2014

    Novel cellulose nanomaterials 

    Type: Conference Paper
    Author : Hollertz, R. , Wagberga, L. , Pitois, C.
    Publisher: IEEE
    Year: 2014

    Fabrication of thermal-based vacuum gauge 

    Type: Journal Paper
    Author : Ho Jung; Tae Hyun Kim; Kyung Tae Kim; Jae Hong Park; Hee Yeoun Kim
    Publisher: IET
    Year: 2014

    Frequency Trimming of Aluminum Nitride Microresonators Using Rapid Thermal Annealing 

    Type: Journal Paper
    Author : Henry, M.D.; Nguyen, John; Young, Travis Ryan; Bauer, Thomas; Olsson, Roy H.
    Publisher: IEEE
    Year: 2014

    Deep stacking networks with time series for speech separation 

    Type: Conference Paper
    Author : Shuai Nie , Hui Zhang , Xueliang Zhang , Wenju Liu
    Publisher: IEEE
    Year: 2014

    Hybrid model for pedestrian movement simulation 

    Type: Conference Paper
    Author : Kormanová , A. , Varga, M. , Adamko, N.
    Publisher: IEEE
    Year: 2014

    CMP process — Integrated chemical & physical phenomena in between wafer and polishing pad 

    Type: Conference Paper
    Author : Kimura, K.; Chen, C.-C.A.
    Publisher: IEEE
    Year: 2014

    Measurement of the field characteristics from High Intensity Focused Ultrasound transducer 

    Type: Conference Paper
    Author : Umchid, S.
    Publisher: IEEE
    Year: 2014
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