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OPTIMUS: OPTImized Mail distribUtion System

Type: Conference Paper

Author : Rosato, F.; Arguello, J.; Cardinale, Y.

Publisher: IEEE

Year: 2014

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

Type: Journal Paper

Author : Jae Woong Choi; Ong Lee Guan; Mao Yingjun; Yusoff, Hilmi B. Mohamad; Xie Jielin; Chow Choi Lan; Woon Lengv Loh; Boon Long Lau; Hong, Linda Liew Hwee; Lau Guan Kian; Murthy, Ramana; Kiat, Eugene Tan Swee

Publisher: IEEE

Year: 2014

Recognition of single and multiple partial discharge sources in transformers based on ultra-high frequency signals

Type: Journal Paper

Author : Sinaga, Herman H.; Phung, B.T.; Blackburn, T.R.

Publisher: IET

Year: 2014

Statistical Modeling of Glitching Effects in Estimation of Dynamic Power Consumption

Type: Conference Paper

Author : Meixner, M. , Noll, T.G.

Year: 2014

The Electromagnetic Articulography Mandarin Accented English (EMA-MAE) corpus of acoustic and 3D articulatory kinematic data

Type: Conference Paper

Author : An Ji , Berry, J.J. , Johnson, M.T.

Publisher: IEEE

Year: 2014

The natural scale of signals: Pulse duration and superoscillations

Type: Conference Paper

Author : Ferreira, P.J.S.G. , Pinho, A.J.

Publisher: IEEE

Year: 2014

Separation and classification of underwater acoustic sources

Type: Conference Paper

Author : Rahmati, Mehdi; Pandey, Parul; Pompili, Dario

Publisher: IEEE

Year: 2014

Simulation of electron escape from GaNAs/GaAs quantum well solar cells

Type: Conference Paper

Author : Yongjie Zou; Honsberg, C.B.; Freundlich, A.; Goodnick, S.M.

Publisher: IEEE

Year: 2014

A measurement chain for the determination of RK using a calculable capacitor

Type: Conference Paper

Author : Fletcher, Nick , Goebel, Roland

Publisher: IEEE

Year: 2014

Development of exposed die large body to die size ratio wafer level package technology

Type: Conference Paper

Publisher: IEEE

Year: 2014

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OPTIMUS: OPTImized Mail distribUtion System

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

Recognition of single and multiple partial discharge sources in transformers based on ultra-high frequency signals

Statistical Modeling of Glitching Effects in Estimation of Dynamic Power Consumption

The Electromagnetic Articulography Mandarin Accented English (EMA-MAE) corpus of acoustic and 3D articulatory kinematic data

The natural scale of signals: Pulse duration and superoscillations

Separation and classification of underwater acoustic sources

Simulation of electron escape from GaNAs/GaAs quantum well solar cells

A measurement chain for the determination of RK using a calculable capacitor

Development of exposed die large body to die size ratio wafer level package technology

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OPTIMUS: OPTImized Mail distribUtion System

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

Recognition of single and multiple partial discharge sources in transformers based on ultra-high frequency signals

Statistical Modeling of Glitching Effects in Estimation of Dynamic Power Consumption

The Electromagnetic Articulography Mandarin Accented English (EMA-MAE) corpus of acoustic and 3D articulatory kinematic data

The natural scale of signals: Pulse duration and superoscillations

Separation and classification of underwater acoustic sources

Simulation of electron escape from GaNAs/GaAs quantum well solar cells

A measurement chain for the determination of RK using a calculable capacitor

Development of exposed die large body to die size ratio wafer level package technology