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RISInterfacial Void in Adhesively Bonded Composite Joint Integrated with Piezoelectric Patch
Year: 2017
Abstract:
cleaning the joining surfaces, controlling the temperature and humidity, etc. are so important. During joining by adhesive, also, care should be taken to prevent entering extra particles within the adhesive layer as well as formation of interfacial voids...
Modeling water–NAPL–air three phase capillary behavior in soils
Publisher: Elsevier
Year: 2014
On thermomechanical stress analysis of adhesively bonded composite joints in presence of an interfacial void
Year: 2015
Abstract:
This paper deals with analytical thermomechanical stress analysis of adhesively bonded composite joints
in presence of a structural imperfection in the form of an interfacial void within the adhesive layer based
on the full layerwise...
FPGA dedicated hardware architecture of 3D image reconstruction: Marching cubes algorithm
Publisher: IEEE
Year: 2014
Cyclic response of footing on geogrid reinforced sand with void
Publisher: Elsevier
Year: 2013
The effects of technological voids on the hydro mechanical behaviour of compacted bentonite–sand mixture
Publisher: Elsevier
Year: 2013
Network-Based Handover for IMS Service Continuity
Publisher: IEEE
Year: 2014
Approximation algorithms for maximum target coverage in directional sensor networks
Publisher: IEEE
Year: 2014
Effect of Martensite Plasticity on the Deformation Behavior of a Low-Carbon Dual-Phase Steel
Year: 2007
Abstract:
codeforms with the ferrite matrix, void
nucleation is suppressed and the final fracture properties are dramatically improved....