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3D Integration Using Self-Assembly at Air-Water-Solid Interface
Publisher: IEEE
Year: 2014
Analysis of Soft Failures in Low-Resistance Interconnect Vias Using Doubly Nesting Arrays
Publisher: IEEE
Year: 2014
An approach for improve the recognition of defects in coffee beans using retinex algorithms
Publisher: IEEE
Year: 2014
Conference Organization
Publisher: IEEE
Year: 2014
[Front and back cover]
Publisher: IEEE
Year: 2014
Design of Novel High-Q Multipath Parallel-Stacked Inductor
Publisher: IEEE
Year: 2014
Dynamic scheduling in application level aware of architecture and data dependencies between tasks
Publisher: IEEE
Year: 2014



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