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Now showing items 1-10 of 18
Multi-Chip Module (MCM-D) using thin film technology
Publisher: IEEE
Year: 2014
Laboratorio remoto eLab3D: Un mundo virtual inmersivo para el aprendizaje de la electrónica
Publisher: IEEE
Year: 2014
Hierarchical Network Coding for Collective Communication on HPC Interconnects
Publisher: IEEE
Year: 2014
Key issues of wind capacity integration in congested areas of the Taiwan power system
Publisher: IET
Year: 2014
Temporal Versus Stochastic Granularity in Thermal Generation Capacity Planning With Wind Power
Publisher: IEEE
Year: 2014
Wrinkle cellomics: Screening bladder cancer cells using an ultra-thin silicone membrane
Publisher: IEEE
Year: 2014
A Parallel Multilevel Spectral Galerkin Solver for Linear Systems with Uncertain Parameters
Publisher: IEEE
Year: 2014
[Copyright notice]
Publisher: IEEE
Year: 2014