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Improved Thermal Performance of SOI Using a Compound Buried Layer
Publisher: IEEE
Year: 2014
Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module
Publisher: IEEE
Year: 2014
Object following control of six-legged robot using Kinect camera
Publisher: IEEE
Year: 2014
Characterization of 6.5 kV IGBTs for High-Power Medium-Frequency Soft-Switched Applications
Publisher: IEEE
Year: 2014
An Active Power-Decoupling Method for Single-Phase AC–DC Converters
Publisher: IEEE
Year: 2014
Modular Multilevel Converter Models for Electromagnetic Transients
Publisher: IEEE
Year: 2014
Bi-manual gesture interaction for 3D cloud point selection and annotation using COTS
Publisher: IEEE
Year: 2014
[Copyright notice]
Publisher: IEEE
Year: 2014
Cloud Computing: A New Age of Computing
Publisher: IEEE
Year: 2014