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Plenary talk: Ubiquitous mobile computing — Growth driver for the semiconductor industry: Technology trends, challenges and opportunities

Type: Conference Paper

Author : Yeap, G.

Publisher: IEEE

Year: 2014

3D integration technology using hybrid wafer bonding and via-last TSV process

Type: Conference Paper

Author : Takeda, K. , Aoki, M.

Publisher: IEEE

Year: 2014

Novel Three-Port Converter With High-Voltage Gain

Type: Journal Paper

Author : Li-Jhan Chien; Chien-Chih Chen; Jiann-Fuh Chen; Yi-Ping Hsieh

Publisher: IEEE

Year: 2014

Search in Social Networks: Designing Models and Algorithms That Maximize Human Influence

Type: Conference Paper

Author : Santana Marin, E. , Luiz de Carvalho, C.

Publisher: IEEE

Year: 2014

Supervision of the current stability level of a power grid

Type: Conference Paper

Author : Avramenko, V. , Chernenko, P. , Prykhno, V.

Publisher: IEEE

Year: 2014

Scale space and free space topology analysis for omnidirectional images

Type: Conference Paper

Author : Marie, R. , Labbani-Igbida, O. , Mouaddib, E.M.

Publisher: IEEE

Year: 2014

A novel sine ridge waveguide for 0.65THz backward wave oscillator

Type: Conference Paper

Author : Zhang, Luqi; Wei, Yanyu; Zhang, Minghao; Ding, Chong; Wang, Yuanyuan; Guo, Guo; Wang, Yanshuai; Yin, Hairong; Zhao, Guoqing; Wang, Wenxiang; Gong, Yubin; Feng, Jinjun; Li, Dazhi

Publisher: IEEE

Year: 2014

Investigation of the electric wind velocity subject to the electrode system design in plasma chemical reactor

Type: Conference Paper

Publisher: IEEE

Year: 2014

Modeling and Control Design of Microgrid-Connected PV-Based Sources

Type: Journal Paper

Author : Elrayyah, Ali; Sozer, Yilmaz; Elbuluk, Malik E.

Publisher: IEEE

Year: 2014

High Efficiency Photovoltaic Source Simulator with Fast Response Time for Solar Power Conditioning Systems Evaluation

Type: Journal Paper

Author : Koran, Ahmed; LaBella, Thomas; Jih-Sheng Lai

Publisher: IEEE

Year: 2014

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Plenary talk: Ubiquitous mobile computing — Growth driver for the semiconductor industry: Technology trends, challenges and opportunities

3D integration technology using hybrid wafer bonding and via-last TSV process

Novel Three-Port Converter With High-Voltage Gain

Search in Social Networks: Designing Models and Algorithms That Maximize Human Influence

Supervision of the current stability level of a power grid

Scale space and free space topology analysis for omnidirectional images

A novel sine ridge waveguide for 0.65THz backward wave oscillator

Investigation of the electric wind velocity subject to the electrode system design in plasma chemical reactor

Modeling and Control Design of Microgrid-Connected PV-Based Sources

High Efficiency Photovoltaic Source Simulator with Fast Response Time for Solar Power Conditioning Systems Evaluation

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Plenary talk: Ubiquitous mobile computing &#x2014; Growth driver for the semiconductor industry: Technology trends, challenges and opportunities

3D integration technology using hybrid wafer bonding and via-last TSV process

Novel Three-Port Converter With High-Voltage Gain

Search in Social Networks: Designing Models and Algorithms That Maximize Human Influence

Supervision of the current stability level of a power grid

Scale space and free space topology analysis for omnidirectional images

A novel sine ridge waveguide for 0.65THz backward wave oscillator

Investigation of the electric wind velocity subject to the electrode system design in plasma chemical reactor

Modeling and Control Design of Microgrid-Connected PV-Based Sources

High Efficiency Photovoltaic Source Simulator with Fast Response Time for Solar Power Conditioning Systems Evaluation

Plenary talk: Ubiquitous mobile computing — Growth driver for the semiconductor industry: Technology trends, challenges and opportunities