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Now showing items 1-10 of 74

Low-cost on-chip structures for combating die and IC recycling

Type: Conference Paper

Publisher: IEEE

Year: 2014

On the Minimality and Uniqueness of the Bott–Duffin Realization Procedure

Type: Journal Paper

Author : Hughes, Timothy H.; Smith, Malcolm C.

Publisher: IEEE

Year: 2014

Lumped Parameter Modeling for Thermal Characterization of High-Power Modules

Type: Journal Paper

Author : Iachello, Marco; De Luca, Viviana; Petrone, Giovanni; Testa, Natale; Fortuna, Luigi; Cammarata, Giuliano; Graziani, Salvatore; Frasca, Mattia

Publisher: IEEE

Year: 2014

Efficient calculation of cyclic convolution by means of fast Fourier transform in a finite field

Type: Conference Paper

Author : Amerbaev, V.M.; Solovyev, R.A.; Stempkovskiy, A.L.; Telpukhov, D.V.

Publisher: IEEE

Year: 2014

Unified hysteresis and creep compensation in AFM tip positioning with an extended PI model

Type: Conference Paper

Publisher: IEEE

Year: 2014

On-chip miniaturised wideband rat-race coupler using integrated passive device technology

Type: Journal Paper

Author : Ying-Cheng Tseng; Tzyh-Ghuang Ma

Publisher: IET

Year: 2014

Effect of series and parallel compensation on operating reliability of transmission system

Type: Conference Paper

Author : Yang, Kun; Lin, Cheng; Liu, Haitao; Sun, Rongfu; Song, Yunting

Publisher: IEEE

Year: 2014

[Copyright notice]

Type: Conference Paper

Publisher: IEEE

Year: 2014

Generation and detection of OAM signals for radio communications

Type: Conference Paper

Author : Cano, Eduardo; Allen, Ben; Bai, Qiang; Tennant, Alan

Publisher: IEEE

Year: 2014

Three-mode controllable master-slave monostable multivibrators using current-feedback operational amplifiers

Type: Journal Paper

Author : Hung-Chun Chien

Publisher: IET

Year: 2014

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Low-cost on-chip structures for combating die and IC recycling

On the Minimality and Uniqueness of the Bott–Duffin Realization Procedure

Lumped Parameter Modeling for Thermal Characterization of High-Power Modules

Efficient calculation of cyclic convolution by means of fast Fourier transform in a finite field

Unified hysteresis and creep compensation in AFM tip positioning with an extended PI model

On-chip miniaturised wideband rat-race coupler using integrated passive device technology

Effect of series and parallel compensation on operating reliability of transmission system

[Copyright notice]

Generation and detection of OAM signals for radio communications

Three-mode controllable master-slave monostable multivibrators using current-feedback operational amplifiers

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Low-cost on-chip structures for combating die and IC recycling

On the Minimality and Uniqueness of the Bott&#x2013;Duffin Realization Procedure

Lumped Parameter Modeling for Thermal Characterization of High-Power Modules

Efficient calculation of cyclic convolution by means of fast Fourier transform in a finite field

Unified hysteresis and creep compensation in AFM tip positioning with an extended PI model

On-chip miniaturised wideband rat-race coupler using integrated passive device technology

Effect of series and parallel compensation on operating reliability of transmission system

[Copyright notice]

Generation and detection of OAM signals for radio communications

Three-mode controllable master-slave monostable multivibrators using current-feedback operational amplifiers

On the Minimality and Uniqueness of the Bott–Duffin Realization Procedure