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Now showing items 1-8 of 8
Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies
Publisher: IEEE
Year: 2014
Aging effect on creep properties of SnBi solders
Publisher: IEEE
Year: 2014
Design and implementation of an electromagnetic clutch system for hub motors
Publisher: IEEE
Year: 2014
Real-time 3D electrical impedance imaging for ventilation monitoring of the lung: Pilot study
Publisher: IEEE
Year: 2014
Performance evaluation of relay site planning
Publisher: IEEE
Year: 2014
Secrecy rate optimization for a MIMO secrecy channel based on Stackelberg game
Publisher: IEEE
Year: 2014
Intense and short millimeter wave pulse generation by using a gyrotron as a light source
Publisher: IEEE
Year: 2014