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Now showing items 1-5 of 5
Managing signal, power and thermal integrity for 3D integration
Publisher: IEEE
Year: 2014
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
Publisher: IEEE
Year: 2014
Numerically stable estimation of scene flow independent of brightness and regularizer weights
Publisher: IEEE
Year: 2014
QoS-aware data transmission and wireless energy transfer: Performance modeling and optimization
Publisher: IEEE
Year: 2014