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Now showing items 1-8 of 8
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
Publisher: IEEE
Year: 2014
Integrated headwall systems — Hybrid headwall design
Publisher: IEEE
Year: 2014
Multi-periodicity induces prominent optical phenomena in plasmonic multilayers
Publisher: IEEE
Year: 2014
List of contributors
Publisher: IEEE
Year: 2014
Large-scale logistic regression and linear support vector machines using spark
Publisher: IEEE
Year: 2014
Tie breaking for singular channels is worth 1 Nat
Publisher: IEEE
Year: 2014
Multitaper estimation of the coherence spectrum in low SNR
Publisher: IEEE
Year: 2014
Decision support modeling for net-zero water buildings
Publisher: IEEE
Year: 2014