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    Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications 

    Type: Conference Paper
    Author : Kusters, R.H.L.; Sridhar, A.; Cauwe, M.; van den Brand, J.
    Publisher: IEEE
    Year: 2014

    Integrated headwall systems — Hybrid headwall design 

    Type: Conference Paper
    Author : Sharma, Ruchika; Marti, Kevin; Monegro, Jesus; Liu, Yue
    Publisher: IEEE
    Year: 2014

    Multi-periodicity induces prominent optical phenomena in plasmonic multilayers 

    Type: Conference Paper
    Author : Orlov, A.A.; Krylova, A.K.; Zhukovsky, S.V.; Babicheva, V.E.; Belov, P.A.
    Publisher: IEEE
    Year: 2014

    List of contributors 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Large-scale logistic regression and linear support vector machines using spark 

    Type: Conference Paper
    Author : Lin, Chieh-Yen; Tsai, Cheng-Hao; Lee, Ching-Pei; Lin, Chih-Jen
    Publisher: IEEE
    Year: 2014

    Tie breaking for singular channels is worth 1 Nat 

    Type: Conference Paper
    Author : Haim, Eli; Kochman, Yuval; Erez, Uri
    Publisher: IEEE
    Year: 2014

    Multitaper estimation of the coherence spectrum in low SNR 

    Type: Conference Paper
    Author : Brynolfsson, Johan; Hansson-Sandsten, Maria
    Publisher: IEEE
    Year: 2014

    Decision support modeling for net-zero water buildings 

    Type: Conference Paper
    Author : Joustra, C.; Yeh, D.
    Publisher: IEEE
    Year: 2014

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