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CMP process — Integrated chemical & physical phenomena in between wafer and polishing pad

Type: Conference Paper

Author : Kimura, K.; Chen, C.-C.A.

Publisher: IEEE

Year: 2014

Termination analysis with recursive calling graphs

Type: Conference Paper

Author : Teng Long; Wenhui Zhang

Publisher: IEEE

Year: 2014

Author

Chen, C.-C.A. (1)

Kimura, K. (1)

Teng Long (1)

Wenhui Zhang (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

n surface mount technology (2)

ball grid arrays (1)

n Assembly (1)

n BGA components (1)

n board level reliability (1)

n board level temperature cycle (1)

n Electric shock (1)

n elongated hour-glass shape (1)

n FEM (1)

n finite element analysis (1)

Type

Conference Paper (2)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

lanarization/CMP Technology (ICPT), 2014 International Conference on (1)

omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE (1)

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