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Event-based organization model for sensing data

Type: Conference Paper

Author : Yunchuan Sun; Junsheng Zhang; Rongfang Bie; Hongli Yan; Ye Xia; Zhangbing Zhou

Publisher: IEEE

Year: 2014

Design considerations for no discharge in space TWTs for long life & reliable satellite communication

Type: Conference Paper

Author : Srivastava, Vishnu

Publisher: IEEE

Year: 2014

Design, simulation and implementation of a novel online patients' health checking method for physicians

Type: Conference Paper

Author : Turjo, F.O.; Islam, M.A.; Bhuiyan, S.U.; Islam, T.; Pathik, B.B.

Publisher: IEEE

Year: 2014

Author

Bhuiyan, S.U. (1)

Hongli Yan (1)

Islam, M.A. (1)

Islam, T. (1)

Junsheng Zhang (1)

Pathik, B.B. (1)

Rongfang Bie (1)

Srivastava, Vishnu (1)

Turjo, F.O. (1)

Ye Xia (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

n three-dimensional integrated circuits (2)

adhesion (1)

copper (1)

integrated circuit design (1)

n Annealing (1)

n blind vias (1)

n bottom-up TSV filling (1)

n bumpless TSV integration approach (1)

n carrier wafer (1)

n Copper (1)

Type

Conference Paper (3)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

iomedical Engineering International Conference (BMEiCON), 2014 7th (1)

ischarges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on (1)

omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE (1)

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