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    Breakwater settlement monitoring with InSAR data 

    Type: Conference Paper
    Author : Pros, F.; Gonzalez-Lopez, S.; Martinez-Benjamin, J.J.; Palau, V.; Duro, J.
    Publisher: IEEE
    Year: 2014

    A “microSD”sized RF transceiver manufactured as an embedded system-in-package 

    Type: Conference Paper
    Author : Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K-D.
    Publisher: IEEE
    Year: 2014

    A Case Study of Visual Analytic Method on Behavior Modification by Movement Therapy 

    Type: Conference Paper
    Author : Lee, Jaeho; Byun, Inkyung; Yoon, Kyoungro
    Publisher: IEEE
    Year: 2014

    P-band polarimetric model of vertical tree stems on sloping ground 

    Type: Conference Paper
    Author : Blomberg, E.; Soja, M.J.; Ulander, L.M.H.
    Publisher: IEEE
    Year: 2014

    A novel ratioed logic style for faster subthreshold digital circuits based on 90 nm CMOS and below 

    Type: Conference Paper
    Author : Weiwei Shi; Chiu-Sing Choy
    Publisher: IEEE
    Year: 2014

    Improvement of epitaxial channel quality on heavily arsenic- and boron-doped Si surfaces and impact on tunnel FET performance 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Research of the coupling effect of span-can penetration and environmental loads on piles 

    Type: Conference Paper
    Author : Tao, Jinghua; Jia, Xu; Hou, Jinlin; Wang, Zhaoyang
    Publisher: IEEE
    Year: 2014

    Skeleton-guided vectorization of Chinese calligraphy images 

    Type: Conference Paper
    Author : Pan, Wanqiong; Lian, Zhouhui; Tang, Yingmin; Xiao, Jianguo
    Publisher: IEEE
    Year: 2014

    A pilot study on affective classification of facial images for emerging news topics 

    Type: Conference Paper
    Author : Zhang, Ligang; Han Lau, Andy Cher; Tjondronegoro, Dian; Chandran, Vinod
    Publisher: IEEE
    Year: 2014

    Use of a state of art equipment for measuring the leak rates to determine the healthiness of VI's 

    Type: Conference Paper
    Author : Kumar, S B Arun; Shrinivasa, A R
    Publisher: IEEE
    Year: 2014
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