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Now showing items 1-10 of 19

High flexibility SCR clamp for ESD protection in BCD power technology

Type: Conference Paper

Author : Chang, Yi-Feng; Tsai, Tsung-Che; Lin, Wan-Yen; Hsu, Chia-Wei; Lee, Jam-Wem; Cheng, Shui-Ming; Song, Ming-Hsiang

Publisher: IEEE

Year: 2014

Analysis of ESD-robustness of Multi Layer Ceramic Capacitors in system applications

Type: Conference Paper

Author : Scheier, Stanislav; Frei, Stephan

Publisher: IEEE

Year: 2014

High-performance X-ray tomography reconstruction algorithm based on heterogeneous accelerated computing systems

Type: Conference Paper

Author : Serrano, Estefania; Bermejo, Guzman; Blas, Javier Garcia; Carretero, Jesus

Publisher: IEEE

Year: 2014

General chairman's welcome

Type: Conference Paper

Author : Gossner, Harald

Publisher: IEEE

Year: 2014

Modular trajectory / path following controller using nonlinear error dynamics

Type: Conference Paper

Author : Schatz, Simon P.; Holzapfel, Florian

Publisher: IEEE

Year: 2014

Evaluation of frequency fluctuation in fiber-wireless link with direct IQ down-converter

Type: Conference Paper

Publisher: IEEE

Year: 2014

Influences of the vertebral endplate microvasculature on the development of degenerative disc diseases: A preliminary study

Type: Conference Paper

Author : Xavier, F.; Hossain, S.; Rousseau, R.; Futerman, E.; Hussain, A.; Chatterjee, D.; Feuer, G.; Hayes, W.; Saha, S.

Publisher: IEEE

Year: 2014

A high-reliable self-isolation current-mode transmitter (CM-Tx) design for +/−60V automotive interface with Bulk-BCD technology

Type: Conference Paper

Author : Hsu, Wen-Yang; Lan, Po-Hsiang; Lin, Wan-Yen; Lee, Jam-Wem; Chen, Kuo-Ji; Song, Ming-Hsiang

Publisher: IEEE

Year: 2014

2013 friendship award in recognition of RCJ 2012 best paper award/Japan

Type: Conference Paper

Author : Nakaie, Toshiyuki; Matsui, Jun; Miyamoto, Yoshiaki; Kuriyama, Toshihide; Maeda, Hiroshi; Takatsuji, Wataru; Ueno, Yoshifumi; Itoh, Takaki

Publisher: IEEE

Year: 2014

ESD device performance analysis in a 14nm FinFET SOI CMOS technology: Fin-based versus planar-based

Type: Conference Paper

Author : Li, Junjun; Gauthier, Robert; Li, You; Mishra, Rahul

Publisher: IEEE

Year: 2014

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High flexibility SCR clamp for ESD protection in BCD power technology

Analysis of ESD-robustness of Multi Layer Ceramic Capacitors in system applications

High-performance X-ray tomography reconstruction algorithm based on heterogeneous accelerated computing systems

General chairman's welcome

Modular trajectory / path following controller using nonlinear error dynamics

Evaluation of frequency fluctuation in fiber-wireless link with direct IQ down-converter

Influences of the vertebral endplate microvasculature on the development of degenerative disc diseases: A preliminary study

A high-reliable self-isolation current-mode transmitter (CM-Tx) design for +/−60V automotive interface with Bulk-BCD technology

2013 friendship award in recognition of RCJ 2012 best paper award/Japan

ESD device performance analysis in a 14nm FinFET SOI CMOS technology: Fin-based versus planar-based

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High flexibility SCR clamp for ESD protection in BCD power technology

Analysis of ESD-robustness of Multi Layer Ceramic Capacitors in system applications

High-performance X-ray tomography reconstruction algorithm based on heterogeneous accelerated computing systems

General chairman's welcome

Modular trajectory / path following controller using nonlinear error dynamics

Evaluation of frequency fluctuation in fiber-wireless link with direct IQ down-converter

Influences of the vertebral endplate microvasculature on the development of degenerative disc diseases: A preliminary study

A high-reliable self-isolation current-mode transmitter (CM-Tx) design for +/&#x2212;60V automotive interface with Bulk-BCD technology

2013 friendship award in recognition of RCJ 2012 best paper award/Japan

ESD device performance analysis in a 14nm FinFET SOI CMOS technology: Fin-based versus planar-based

A high-reliable self-isolation current-mode transmitter (CM-Tx) design for +/−60V automotive interface with Bulk-BCD technology