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Influencing factors on motor vibration & rotor critical speed in design, test and field applications

Type: Conference Paper

Author : Mistry, Raj; Finley, Bill; Kreitzer, Scott; Queen, Ryan

Publisher: IEEE

Year: 2014

A cost sensitive approach for Virtual Network reconfiguration

Type: Conference Paper

Author : Li Xu; Guozhen Tan; Xia Zhang

Publisher: IEEE

Year: 2014

Author

Finley, Bill (1)

Guozhen Tan (1)

Kreitzer, Scott (1)

Li Xu (1)

Mistry, Raj (1)

Queen, Ryan (1)

Xia Zhang (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

n integrated circuit packaging (2)

n three-dimensional integrated circuits (2)

copper (1)

integrated circuit bonding (1)

n 3D IC technology (1)

n advanced package application (1)

n bump height (1)

n bump height TTV (1)

n bump pitch migration (1)

n capillary-type underfill (1)

Type

Conference Paper (2)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

etroleum and Chemical Industry Technical Conference (PCIC), 2014 IEEE (1)

omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE (1)

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