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Optimization of the wafer level molding process for high power device module
Publisher: IEEE
Year: 2014
Monolithic 3D integration in a CMOS process flow
Publisher: IEEE
Year: 2014
Joint transmit beamforming and antenna selection for energy efficiency maximization in MISO downlink
Publisher: IEEE
Year: 2014
AnglaBharati to AnglaMalayalam: An Experience with English to Indian Language Machine Translation
Publisher: IEEE
Year: 2014
Sentence generation from a bag of words using N-gram model
Publisher: IEEE
Year: 2014
An efficient color image quality metric with local-tuned-global model
Publisher: IEEE
Year: 2014
Reliability functions used for the maintenance procedures
Publisher: IEEE
Year: 2014
Novel analysis and modeling of lossy sub-millimeter waveguides
Publisher: IEEE
Year: 2014
Improving Hard Disk Contention-Based Covert Channel in Cloud Computing
Publisher: IEEE
Year: 2014
Codes over ℤ<inf>4</inf>+vℤ<inf>4</inf>
Publisher: IEEE
Year: 2014