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Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers

Type: Conference Paper

Author : Liu, Junpeng; Redei, Richard; Qi, Siyuan; Hutt, David A.; Whalley, David

Publisher: IEEE

Year: 2014

[Copyright notice]

Type: Conference Paper

Publisher: IEEE

Year: 2014

Embedding FPGA overlays into configurable Systems-on-Chip: ReconOS meets ZUMA

Type: Conference Paper

Author : Wiersema, Tobias; Bockhorn, Ame; Platzner, Marco

Publisher: IEEE

Year: 2014

A two-phase electric quantity-based fault location algorithm for power distribution systems

Type: Conference Paper

Author : Shenxing Shi; Minxin Wu; Xinzhou Dong

Publisher: IEEE

Year: 2014

A small area 10-bit linear gamma DAC with voltage adder for large-sized active matrix flat panel displays

Type: Conference Paper

Author : Bae, Jae-Yoon; Seol, Hyeon-Cheon; Kwon, Young-Cheon; Hong, Seong-Kwan; Kwon, Oh-Kyong; Hwang, Seong-Hwan; Kim, Seung-Tae

Publisher: IEEE

Year: 2014

Broadband fully silicon integrated differential balun and LNA for space applications

Type: Conference Paper

Author : Germain, Y.; Lintignat, J.; Jarry, B.; Barelaud, B.; Armengaud, V.; Lapierre, L.

Publisher: IEEE

Year: 2014

A phase-based ranging method for fast frequency hopping system

Type: Conference Paper

Author : Liu, Yue; Qi, Wangdong; Zhang, Su; Wang, Zhi

Publisher: IEEE

Year: 2014

Secure communications of cellular users in device-to-device communication underlaying cellular networks

Type: Conference Paper

Author : Wang, Yuhang; Chen, Zhiyong; Yao, Yao; Shen, Manyuan; Xia, Bin

Publisher: IEEE

Year: 2014

Lightweight forensic video watermarking to enable premium content consumption on mobile devices

Type: Conference Paper

Author : Robert, Antoine; Doerr, Gwenael

Publisher: IEEE

Year: 2014

A novel hybrid dynamic simulation algorithm based on iterative coordination

Type: Conference Paper

Author : Huang, Shaowei; Chen, Ying; Shen, Chen; Chen, Laijun

Publisher: IEEE

Year: 2014

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Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers

[Copyright notice]

Embedding FPGA overlays into configurable Systems-on-Chip: ReconOS meets ZUMA

A two-phase electric quantity-based fault location algorithm for power distribution systems

A small area 10-bit linear gamma DAC with voltage adder for large-sized active matrix flat panel displays

Broadband fully silicon integrated differential balun and LNA for space applications

A phase-based ranging method for fast frequency hopping system

Secure communications of cellular users in device-to-device communication underlaying cellular networks

Lightweight forensic video watermarking to enable premium content consumption on mobile devices

A novel hybrid dynamic simulation algorithm based on iterative coordination

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Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers

[Copyright notice]

Embedding FPGA overlays into configurable Systems-on-Chip: ReconOS meets ZUMA

A two-phase electric quantity-based fault location algorithm for power distribution systems

A small area 10-bit linear gamma DAC with voltage adder for large-sized active matrix flat panel displays

Broadband fully silicon integrated differential balun and LNA for space applications

A phase-based ranging method for fast frequency hopping system

Secure communications of cellular users in device-to-device communication underlaying cellular networks

Lightweight forensic video watermarking to enable premium content consumption on mobile devices

A novel hybrid dynamic simulation algorithm based on iterative coordination