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Through silicon via (TSV) scallop smoothening technique
Publisher: IEEE
Year: 2014
Structure reliability and characterization for FC package w/Embedded Trace coreless Substrate
Publisher: IEEE
Year: 2014
Rapid SVBRDF Measurement by Algebraic Solution Based on Adaptive Illumination
Publisher: IEEE
Year: 2014
Uberveillance and the Internet of Things and people
Publisher: IEEE
Year: 2014
FFC NMR relaxometers on education: Topologies, control techniques and electromagnetic devices
Publisher: IEEE
Year: 2014
Large-scale distributed sorting for GPU-based heterogeneous supercomputers
Publisher: IEEE
Year: 2014
A varactor diodes selection for the broadband microwave voltage controlled oscillator
Publisher: IEEE
Year: 2014
Study on radargram characteristics of the backfill grouting quality evaluation of a shield tunnel using GPR
Publisher: IEEE
Year: 2014
A simulator based performance analysis of multilevel feedback queue scheduling
Publisher: IEEE
Year: 2014