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Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

Type: Conference Paper

Author : Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, A.; Dittrich, M.; Wolf, J.

Publisher: IEEE

Year: 2014

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Type: Conference Paper

Author : Lim, Sharon Pei-Siang; Ding, Mian Zhi; Dexter Velez, Sorono; Cereno, Daniel Ismael; Lin, Jong Kai; Rao, Vempati Srinivasa

Publisher: IEEE

Year: 2014

Investigation of Alternative Evolutionary Prototype Generation in Medical Classification

Type: Conference Paper

Author : Stoean, Catalin; Stoean, Ruxandra; Sandita, Adrian

Publisher: IEEE

Year: 2014

Title Page iii

Type: Conference Paper

Publisher: IEEE

Year: 2014

A study on low grid voltage problem near Rooppur nuclear power plant

Type: Conference Paper

Author : Chowdhury, A.Hasib; Rabby, Md.Khurram Monir

Publisher: IEEE

Year: 2014

Sinter paste for power packages

Type: Conference Paper

Author : Xin, Yong Ling

Publisher: IEEE

Year: 2014

Multioriented video scene based image dehazing using artificial bee colony optimization

Type: Conference Paper

Author : Chitra, S.; Raja, M.Arokia Irudaya

Publisher: IEEE

Year: 2014

Enforcing adaptive user modeling using ontology

Type: Conference Paper

Author : Potey, Madhuri A.; Sadafule, Rajashri S.; Sinha, P.K.

Publisher: IEEE

Year: 2014

Business regulation for consumer welfare- consumer protection in India, related to marketing

Type: Conference Paper

Author : Agasti, Sarmistha; Sengupta, Partha Pratim

Publisher: IEEE

Year: 2014

Development and performance analysis of a two-phase induction motor in the frame and core of a single-phase induction motor

Type: Conference Paper

Author : Khan, Md Ayubur Rahman; Ahsan, Md Quamrul

Publisher: IEEE

Year: 2014

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Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Investigation of Alternative Evolutionary Prototype Generation in Medical Classification

Title Page iii

A study on low grid voltage problem near Rooppur nuclear power plant

Sinter paste for power packages

Multioriented video scene based image dehazing using artificial bee colony optimization

Enforcing adaptive user modeling using ontology

Business regulation for consumer welfare- consumer protection in India, related to marketing

Development and performance analysis of a two-phase induction motor in the frame and core of a single-phase induction motor

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Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Investigation of Alternative Evolutionary Prototype Generation in Medical Classification

Title Page iii

A study on low grid voltage problem near Rooppur nuclear power plant

Sinter paste for power packages

Multioriented video scene based image dehazing using artificial bee colony optimization

Enforcing adaptive user modeling using ontology

Business regulation for consumer welfare- consumer protection in India, related to marketing

Development and performance analysis of a two-phase induction motor in the frame and core of a single-phase induction motor