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Study on surface waves in a medium plate made from negative index materials

Type: Conference Paper

Publisher: IEEE

Year: 2014

Voice conversion using conditional restricted Boltzmann machine

Type: Conference Paper

Author : Fengyun Zhu , Ziye Fan , Xihong Wu

Publisher: IEEE

Year: 2014

Sensitivity characteristics of Ag doped BaTiO<inf>3</inf>-CuO mixed oxide as carbon-dioxide sensor

Type: Conference Paper

Author : Rudraswamy, S.B. , Basu, P.K. , Bhat, N.

Year: 2014

Calculation of all gains providing time-delay independent stability via root locus

Type: Conference Paper

Author : Nesimioglu, Baris Samim; Soylemez, Mehmet Turan

Publisher: IEEE

Year: 2014

Micro-IMU based Wireless Body Sensor Network

Type: Conference Paper

Author : Fei Yunfeng , Song Yinhao , Xu Lin , Sun Guangyi

Publisher: IEEE

Year: 2014

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

Type: Conference Paper

Publisher: IEEE

Year: 2014

Bondgraph model for system of systems wireless communication link

Type: Conference Paper

Author : Koubeissi, A. , Ayache, M. , Merzouki, R.

Publisher: IEEE

Year: 2014

Packaging high-coupling photonics devices and modules by combination of the art and science

Type: Conference Paper

Author : Wood-Hi Cheng , Yi-Chung Huang , Wen-Hsuan Hsieh

Publisher: IEEE

Year: 2014

CCNF for continuous emotion tracking in music: Comparison with CCRF and relative feature representation

Type: Conference Paper

Author : Imbrasaite, V. , Baltrusaitis, T. , Robinson, P.

Publisher: IEEE

Year: 2014

Implementation of DTCP-IP protected content on Android devices

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Study on surface waves in a medium plate made from negative index materials

Voice conversion using conditional restricted Boltzmann machine

Sensitivity characteristics of Ag doped BaTiO<inf>3</inf>-CuO mixed oxide as carbon-dioxide sensor

Calculation of all gains providing time-delay independent stability via root locus

Micro-IMU based Wireless Body Sensor Network

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

Bondgraph model for system of systems wireless communication link

Packaging high-coupling photonics devices and modules by combination of the art and science

CCNF for continuous emotion tracking in music: Comparison with CCRF and relative feature representation

Implementation of DTCP-IP protected content on Android devices

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Study on surface waves in a medium plate made from negative index materials

Voice conversion using conditional restricted Boltzmann machine

Sensitivity characteristics of Ag doped BaTiO<inf>3</inf>-CuO mixed oxide as carbon-dioxide sensor

Calculation of all gains providing time-delay independent stability via root locus

Micro-IMU based Wireless Body Sensor Network

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

Bondgraph model for system of systems wireless communication link

Packaging high-coupling photonics devices and modules by combination of the art and science

CCNF for continuous emotion tracking in music: Comparison with CCRF and relative feature representation

Implementation of DTCP-IP protected content on Android devices