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Now showing items 1-10 of 17

Simulation-aided UT weld inspection for improving integrity during pipe manufacture

Type: Conference Paper

Author : Rebello, J.M.A.; Burrowes, M.; Ribeiro Pereira, G.; Tavares, L.M.; Ponciano, M.; Manao, R.

Publisher: IEEE

Year: 2014

Smartphone Malware and Its Propagation Modeling: A Survey

Type: Journal Paper

Author : Sancheng Peng; Shui Yu; Aimin Yang

Publisher: IEEE

Year: 2014

Underlay versus interweaved cognitive radio networks: A performance comparison study

Type: Conference Paper

Author : Filippou, M.C. , Gesbert, D. , Ropokis, G.A.

Publisher: IEEE

Year: 2014

Cu Pillar flip chip assembly: Chip attach process failure mode study

Type: Conference Paper

Author : Shengmin Wen , Baloglu, B. , Guangfeng Li

Publisher: IEEE

Year: 2014

High speed LDPC decoder design based on general overlapped message-passing architecture

Type: Conference Paper

Publisher: IEEE

Year: 2014

Multi-party Key-Exchange with Perfect Forward Secrecy

Type: Conference Paper

Author : Mandal, Susmita; Mohanty, Sujata

Publisher: IEEE

Year: 2014

Demystifying the magic of cache thresholds in the Android media framework

Type: Conference Paper

Author : Huang, Jian; Wu, Di; He, Jian

Publisher: IEEE

Year: 2014

Evaluating the effect of particle distribution and dispersion on the dielectric response of boron nitride - epoxy nanocomposites

Type: Conference Paper

Publisher: IEEE

Year: 2014

A 49-dB DR wide locking range hybrid AGC for an ISM-band receiver in 0.18 um CMOS

Type: Conference Paper

Author : Ying Song; Xiaobao Yu; Zongming Jin; Baoyong Chi

Publisher: IEEE

Year: 2014

Road pedestrian detection based on a cascade of feature classifiers

Type: Conference Paper

Author : Zhang, Xiao; Song, Huansheng; Cui, Hua

Publisher: IEEE

Year: 2014

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Simulation-aided UT weld inspection for improving integrity during pipe manufacture

Smartphone Malware and Its Propagation Modeling: A Survey

Underlay versus interweaved cognitive radio networks: A performance comparison study

Cu Pillar flip chip assembly: Chip attach process failure mode study

High speed LDPC decoder design based on general overlapped message-passing architecture

Multi-party Key-Exchange with Perfect Forward Secrecy

Demystifying the magic of cache thresholds in the Android media framework

Evaluating the effect of particle distribution and dispersion on the dielectric response of boron nitride - epoxy nanocomposites

A 49-dB DR wide locking range hybrid AGC for an ISM-band receiver in 0.18 um CMOS

Road pedestrian detection based on a cascade of feature classifiers

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Simulation-aided UT weld inspection for improving integrity during pipe manufacture

Smartphone Malware and Its Propagation Modeling: A Survey

Underlay versus interweaved cognitive radio networks: A performance comparison study

Cu Pillar flip chip assembly: Chip attach process failure mode study

High speed LDPC decoder design based on general overlapped message-passing architecture

Multi-party Key-Exchange with Perfect Forward Secrecy

Demystifying the magic of cache thresholds in the Android media framework

Evaluating the effect of particle distribution and dispersion on the dielectric response of boron nitride - epoxy nanocomposites

A 49-dB DR wide locking range hybrid AGC for an ISM-band receiver in 0.18 um CMOS

Road pedestrian detection based on a cascade of feature classifiers