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Now showing items 1-10 of 30

The selection of chemicals in CMP slurry via electrochemical screening

Type: Conference Paper

Author : Te-Yu Wei; Guevenc, H.O.; Leunissen, L.H.A.

Publisher: IEEE

Year: 2014

Evolution of nature-inspired optimization for new generation antenna design

Type: Conference Paper

Author : Oliveri, G.; Rocca, P.; Salucci, M.; Massa, A.

Publisher: IEEE

Year: 2014

Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI

Type: Journal Paper

Author : Nimur, Masatsugu; Mizuno, Jun; Shoji, Shuji; Sakuma, Keita; Ogino, Hiroshi; Enomoto, Tetsuya; Shigetou, Akitsu

Publisher: IEEE

Year: 2014

Prediction of electric vehicle ownership based on Gompertz model

Type: Conference Paper

Author : Xiaolei Li; Enjie Wang; Chengjin Zhang

Publisher: IEEE

Year: 2014

Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module

Type: Conference Paper

Author : Flowers, C.A.; Eisler, C.N.; Atwater, H.A.

Publisher: IEEE

Year: 2014

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Type: Journal Paper

Author : Li Zheng; Yue Zhang; Gang Huang; Bakir, Muhannad S.

Publisher: IEEE

Year: 2014

Atomically smooth gallium nitride surfaces generated by chemical mechanical polishing with non-noble metal catalyst(Fe-N<inf>x</inf>/C) in acid solution

Type: Conference Paper

Author : Li Xu; Guoshun Pan; Chunli Zou; Xiaolei Shi; Yuyu Liu

Publisher: IEEE

Year: 2014

Application-Independent Testing of 3-D Field Programmable Gate Array Interconnect Faults

Type: Journal Paper

Author : Yen-Lin Peng; Ding-Ming Kwai; Yung-Fa Chou; Cheng-Wen Wu

Publisher: IEEE

Year: 2014

Side trip multi-path routing protocol for spatial node failure tolerance in data-gathering WSNs

Type: Conference Paper

Author : Fujita, K. , Takaki, Y. , Ohta, C. , Tamaki, H.

Publisher: IEEE

Year: 2014

Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs

Type: Journal Paper

Author : Ran Wang; Chakrabarty, Krishnendu; Eklow, Bill

Publisher: IEEE

Year: 2014

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The selection of chemicals in CMP slurry via electrochemical screening

Evolution of nature-inspired optimization for new generation antenna design

Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI

Prediction of electric vehicle ownership based on Gompertz model

Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Atomically smooth gallium nitride surfaces generated by chemical mechanical polishing with non-noble metal catalyst(Fe-N<inf>x</inf>/C) in acid solution

Application-Independent Testing of 3-D Field Programmable Gate Array Interconnect Faults

Side trip multi-path routing protocol for spatial node failure tolerance in data-gathering WSNs

Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs

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The selection of chemicals in CMP slurry via electrochemical screening

Evolution of nature-inspired optimization for new generation antenna design

Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI

Prediction of electric vehicle ownership based on Gompertz model

Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Atomically smooth gallium nitride surfaces generated by chemical mechanical polishing with non-noble metal catalyst(Fe-N<inf>x</inf>/C) in acid solution

Application-Independent Testing of 3-D Field Programmable Gate Array Interconnect Faults

Side trip multi-path routing protocol for spatial node failure tolerance in data-gathering WSNs

Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs