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600 V-18 A GaN Power MOS-HEMTs on 150 mm Si Substrates With Au-Free Electrodes

Type: Journal Paper

Author : Deok Won Seo; Hong Goo Choi; Twynam, John; Ki Min Kim; Jeong Soon Yim; Sung-Woon Moon; Sungdal Jung; Jongsub Lee; Roh, Sungwon D.

Publisher: IEEE

Year: 2014

Effect of Cu and PdCu wire bonding on bond pad splash

Type: Journal Paper

Author : Tan, Y.Y.; Sim, K.S.

Publisher: IET

Year: 2014

Hardware Implementation of MUSIC and ESPRIT on NI-PXI Platform

Type: Conference Paper

Author : Tayem, N.; Omer, M.; Hussain, A.Abul

Publisher: IEEE

Year: 2014

Accelerating the general band matrix multiplication using graphics processors

Type: Conference Paper

Author : Benner, P.; Remon, A.; Dufrechou, E.; Ezzatti, P.; Quintana-Orti, E.S.

Publisher: IEEE

Year: 2014

Detecting spam reviewers by combing reviewer feature and relationship

Type: Conference Paper

Author : Liang, Dongxu; Liu, Xinyue; Shen, Hua

Publisher: IEEE

Year: 2014

FPGA-based prototyping systems for emerging memory technologies

Type: Conference Paper

Author : Lee, T.; Kim, D.; Park, H.; Yoo, S.; Lee, S.

Publisher: IEEE

Year: 2014

Paste Rheology Correlating With Dispensed Finger Geometry

Type: Journal Paper

Author : Pospischil, M.; Specht, J.; Konig, Markus; Horteis, Matthias; Mohr, C.; Clement, Florian; Biro, Daniel

Publisher: IEEE

Year: 2014

Current Conduction Mechanism of Front-Side Contact of N-Type Crystalline Si Solar Cells With Ag/Al Pastes

Type: Journal Paper

Author : Liang Liang; Zhigang Li; Lap Kin Cheng; Takeda, Nobuo; Young, R.J.S.; Carroll, Aaron

Publisher: IEEE

Year: 2014

Bi-Helix SWS for High-Power TWTs

Type: Journal Paper

Author : Pchelnikov, Yuriy N.; Chernin, D.; Vlasov, Alexander N.

Publisher: IEEE

Year: 2014

High Efficiency Multi-busbar Solar Cells and Modules

Type: Journal Paper

Author : Braun, Sebastian; Nissler, Robin; Ebert, C.; Habermann, Danilo; Hahn, Giso

Publisher: IEEE

Year: 2014

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600 V-18 A GaN Power MOS-HEMTs on 150 mm Si Substrates With Au-Free Electrodes

Effect of Cu and PdCu wire bonding on bond pad splash

Hardware Implementation of MUSIC and ESPRIT on NI-PXI Platform

Accelerating the general band matrix multiplication using graphics processors

Detecting spam reviewers by combing reviewer feature and relationship

FPGA-based prototyping systems for emerging memory technologies

Paste Rheology Correlating With Dispensed Finger Geometry

Current Conduction Mechanism of Front-Side Contact of N-Type Crystalline Si Solar Cells With Ag/Al Pastes

Bi-Helix SWS for High-Power TWTs

High Efficiency Multi-busbar Solar Cells and Modules

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600 V-18 A GaN Power MOS-HEMTs on 150 mm Si Substrates With Au-Free Electrodes

Effect of Cu and PdCu wire bonding on bond pad splash

Hardware Implementation of MUSIC and ESPRIT on NI-PXI Platform

Accelerating the general band matrix multiplication using graphics processors

Detecting spam reviewers by combing reviewer feature and relationship

FPGA-based prototyping systems for emerging memory technologies

Paste Rheology Correlating With Dispensed Finger Geometry

Current Conduction Mechanism of Front-Side Contact of N-Type Crystalline Si Solar Cells With Ag/Al Pastes

Bi-Helix SWS for High-Power TWTs

High Efficiency Multi-busbar Solar Cells and Modules