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Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

Type: Journal Paper

Author : Yu-San Chien; Yan-Pin Huang; Ruoh-Ning Tzeng; Ming-Shaw Shy; Teu-Hua Lin; Kou-Hua Chen; Chi-Tsung Chiu; Ching-Te Chuang; Wei Hwang; Jin-Chern Chiou; Ho-Ming Tong; Kuan-Neng Chen

Publisher: IEEE

Year: 2014

The study of high frequency electromagnetic shielding performance by numerical modeling

Type: Conference Paper

Author : Miron, Florin; Purcar, Marius; Munteanu, Calin; Mihai, George

Publisher: IEEE

Year: 2014

Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

The study of high frequency electromagnetic shielding performance by numerical modeling

Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7

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Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

The study of high frequency electromagnetic shielding performance by numerical modeling

Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7