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Development of exposed die large body to die size ratio wafer level package technology

Type: Conference Paper

Publisher: IEEE

Year: 2014

A Simple Model Describing the Symmetric <formula formulatype="inline"> <img src="/images/tex/21072.gif" alt="I\\hbox {--}V"> </formula> Characteristics of <formula formulatype="inline"> <img src="/images/tex/21456.gif" alt="\\hbox {p}"> </formula> Polycrystalline Si/ <formula formulatype="inline"> <img src="/images/tex/18665.gif" alt="\\hbox {n}"> </formula

Type: Journal Paper

Author : Peibst, Robby; Rö mer, Udo; Hofmann, Karl Rudiger; Lim, B.; Wietler, Tobias F.; Krü gener, Jan; Harder, Nils-Peter; Brendel, Rolf

Publisher: IEEE

Year: 2014

Blind and universal DSP for arbitrary modulation formats and time domain hybrid QAM transmissions

Type: Conference Paper

Publisher: IEEE

Year: 2014

Performance dependence of single-carrier digital back-propagation on fiber types and data rates

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Brendel, Rolf (1)

gener, Jan (1)

Harder, Nils-Peter (1)

Hofmann, Karl Rudiger (1)

Kru&#x0308 (1)

Lim, B. (1)

mer, Udo (1)

Peibst, Robby (1)

Ro&#x0308 (1)

Wietler, Tobias F. (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

solar cells (3)

Firing (2)

Metallization (2)

passivation (2)

Photovoltaic cells (2)

Silicon (2)

silicon (2)

/sub&gt (1)

2&lt (1)

2D numerical device simulations (1)

Type

Conference Paper (3)

Journal Paper (1)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

ptical Fiber Communications Conference and Exhibition (OFC), 2014 (2)

lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th (1)

Photovoltaics, IEEE Journal of (1)

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