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Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

Type: Journal Paper

Author : Chih-Fan Lin; Chih-Ming Chen; Wei-Ping Dow; Hung-Hsin Liu; Ho-Chun Tien; Shih-Fu Lee; Wei-Ming Chen

Publisher: IEEE

Year: 2014

Baseband signal processing with UnetStack

Type: Conference Paper

Author : Chitre, M.; Bhatnagar, R.; Ignatius, M.; Suman, S.

Publisher: IEEE

Year: 2014

On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Type: Conference Paper

Author : Kleider, John; Steenhoek, Chris

Publisher: IEEE

Year: 2014

Cyclic Feature Concealing CP Selection for Physical Layer Security

Type: Conference Paper

Author : Ankaral, Z.Esat; Karabacak, Murat; Arslan, Huseyin

Publisher: IEEE

Year: 2014

Generator of Ethnocultural Learning Objects for the preservation of the languages, customs and traditions indigenous

Type: Conference Paper

Author : Silva Sprock, A.; Ponce Gallegos, J.; Munoz Arteaga, J.

Publisher: IEEE

Year: 2014

Arc flash hazard reduction at incoming terminals of LV equipment

Type: Conference Paper

Publisher: IEEE

Year: 2014

Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages

Type: Journal Paper

Author : Mandic, Tvrtko; Nauwelaers, Bart K. J. C.; Baric, Adrijan

Publisher: IEEE

Year: 2014

Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module

Type: Journal Paper

Author : Wei Kexin; Du Mingxing; Xie Linlin; Li Jian

Publisher: IEEE

Year: 2014

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Type: Journal Paper

Author : Kongjing Li; Gui Yun Tian; Liang Cheng; Aijun Yin; Wenping Cao; Crichton, Stuart

Publisher: IEEE

Year: 2014

Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film

Type: Journal Paper

Author : Kyung-Rok Kim; Chang-Wan Ha; Kyung-Soo Kim; Won-Soo Yun

Publisher: IEEE

Year: 2014

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Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

Baseband signal processing with UnetStack

On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Cyclic Feature Concealing CP Selection for Physical Layer Security

Generator of Ethnocultural Learning Objects for the preservation of the languages, customs and traditions indigenous

Arc flash hazard reduction at incoming terminals of LV equipment

Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages

Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film

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Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

Baseband signal processing with UnetStack

On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Cyclic Feature Concealing CP Selection for Physical Layer Security

Generator of Ethnocultural Learning Objects for the preservation of the languages, customs and traditions indigenous

Arc flash hazard reduction at incoming terminals of LV equipment

Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages

Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film